結構分析軟體
Ansys 提供結構分析軟體解決方案，可讓各個級別和背景的工程師更快速、更有效地解決複雜的結構工程問題。利用我們的工具套組，工程師可執行有限元素分析 (FEA)，針對結構力學挑戰自訂和自動化解決方案，並分析多種設計場景。透過在設計週期早期使用我們的軟體，企業可以節省成本，減少設計週期的次數，並更快地將產品推向市場。
Structures
結構分析和模擬軟體解決方案
Ansys Structures
高階功能
利用我們全方位的結構分析工具套組，工程師可以模擬衝擊、摔落和振動、衝擊和穿透、猛撞和碰撞、乘坐者安全、熱傳遞、焊料疲勞、重複載入等各種狀況。Ansys 結構分析使用一系列應用程式和產品整合，可協助您解決最棘手的產品開發問題。
Cloud-based Engineering Simulation
Variation analysis and simulation orchestration
Structures 產品
January 2025
What's New
The 2025 R1 release of Ansys Structures introduces a suite of new features designed to provide holistic advantages to our customers.
Ansys Mechanical delivers powerful enhancements to solver capabilities, comprehension integration for NVH (noise, vibration, and harshness) applications, and advanced tools for material and crack growth analysis. These upgrades empower engineers to handle large, demanding models with improved accuracy, efficiency, and reliability across various industries.
- Advanced Solver Capabilities
- One-Stop-Shop for NVH
- Advanced Material and Crack Growth Analysis
Ansys LS-DYNA offers new solvers and methods that accurately describe real-world applications, from gas flows to adhesives and batteries.
- Introduction of Continuum Particle Gas (CPG)
- Enhanced Incompressible Smoothed Particle Galerkin (ISPG) Method
- Extended Multiphysics / Battery Capabilities
Ansys Sherlock offers new features centered around Thermal-Mech life predictions for BGA packages. In addition to PySherlock updates with new APIs and the automation of certain workflows.
- Thermal-Mech Life Predictions for BGA Packages
- PySherlock Updates and Automation
- Sherlock-Workbench and Sherlock Performance Enhancements
Ansys Sound offers new capabilities and enhancements with regards to psychoacoustics, Sound Power Level and the spectrum.
- Psychoacoustics Criteria in PyAnsys Sound
- Sound Power Level in SAS and PyAnsys Sound
- Generating Sound from Spectrum in SAS
Ansys Motion offers a new, single unified product for enhanced performance and added capabilities.
- Amplified Power / Single Product Packaging
- Improved Solver Speed and Accuracy
- Condensed Part Capabilities Enhancements
Webinars
功能
輕鬆處理您可能面臨的各種設計環境的複雜性。分析工具的範圍可讓您的產品符合效能目標，並隨著時間推移仍能維持不變的效能。
精選線上研討會
On Demand Webinar
使用 Ansys SIwave、Icepak、Mechanical 和 Sherlock 對 PCB 進行電氣和熱可靠性分析
在本次線上研討會中，瞭解如何將 Ansys SIwave、Ansys Icepak、Ansys Mechanical 和 Ansys Sherlock 用作最佳化 PCB 可靠性的全方位重物理解決方案。
案例研究
查看 Ansys 的服務與產品
查看 Ansys 的服務與產品
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