Join our webinar to discover how the new Ansys HFSS-IC can revolutionize the simulation of complex interposers and 3DIC systems, improving design cycles and product performance for advanced packaging teams.
Venue:
Virtual
One of the biggest challenges faced by 3D-IC and advanced packaging teams today is the accurate and efficient simulation of complex interposers and 3D-IC systems, which can significantly impact design cycles and product performance. Ansys HFSS-IC offers new and enhanced technologies that provide greater capacity and performance for the simulation of interposer and 3D-IC.
In this webinar, we will present the latest workflows and simulation technologies enabling engineering teams developing interposers and 3DIC systems to leverage the speed and accuracy of HFSS.
Advanced packaging engineers who are interested in learning best practices for interposer extraction and system assembly modeling.
