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Electronics Failure Analysis

Reliability Engineering Services

Unexpected failures in electronic products can mean revenue or reputation loss, time-to-market delays, increased testing or warranty costs, and a host of other critical challenges. Failure can occur at the board, component, die, or system level, with complex interactions between the environment and the product contributing to the root cause. 

Our Reliability Engineering Services team identifies the root causes of failures and helps prevent them from reoccurring.

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Failure Analysis of Electronics is Critical to Product Success

You need a thorough failure analysis before you can resume testing, kick off a redesign, prevent further field failures, or address the cause of warranty returns. 

A failure analysis can answer questions such as

  • Where did the failure occur?  
  • What caused the failure?  
  • Why is failure intermittent? 
  • How can failure be prevented in the future? 
  • How can I determine if inventoried or fielded products are at risk? 
  • Why did the product fail in the field but not during screening or qualification testing?

How We Approach Electronics Failure Analysis

While hundreds of companies offer failure analysis services, the analysis typically stops when the failure site is discovered. At that point, you are on your own to determine how the failure occurred and how to prevent it in the future. At Ansys, finding and characterizing the failure site is the first step in a complete failure analysis.  

The Ansys Reliability Engineering Services team approaches each failure analysis from a reliability physics perspective, seeking to understand the physical, electrical, mechanical, materials, physics, and chemistry issues contributing to failure. Grounded in the physics of failure, our team of electronics industry and reliability experts focuses on what caused the failure and practical solutions to prevent the failure.  

Electronics Failure Analysis
Early Failure Detection: Control Board

A manufacturer of control boards was experiencing elevated leakage currents and failures of a thermistor component and sought to identify the root cause of the failures. Ansys Reliability Engineering Services (RES) determined the failure mode, the root cause of the failure, and ways to mitigate the failure going forward.

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Electronics Failure Analysis
How to Identify Common Electronic Component Failures

Component-level electronic failures refer to failures occurring within an electronic component soldered to a printed circuit board. Often, when a failure is isolated to a specific electronic component, further electrical characterization—such as comparative curve tracing—can be used to isolate the failure to a specific pin.

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Electronics Failure Analysis
Thermal Cycling Failure in Electronics

Energy flowing through several layers of tightly stacked materials causes devices to heat up and then rapidly cool down. This repeated oscillation between temperatures over a device’s lifetime is called thermal cycling.

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Electronics Failure Analysis

How Ansys Tackles Electronics Failure Analysis

Our team of engineers and scientists has decades of industry and electronics failure analysis experience and has seen thousands of electronics failures across every industry vertical that designs, manufactures, or uses electronics.

Our multidisciplinary team includes electrical, mechanical, and aerospace engineers, chemists, and physicists with electronics design, test, manufacturing, and product support backgrounds. From consumer products to the most advanced automotive, medical, and aerospace systems, our team has helped thousands of companies solve their most critical reliability challenges for nearly 20 years.

Electronics Failure Analysis Capabilities

A complete failure analysis may require nondestructive and destructive techniques to locate and characterize a failure site and understand the failure mechanisms. The Ansys Reliability Engineering Services team has a wide range of nondestructive and destructive capabilities on-site at our facility. The table below summarizes the most common techniques we apply. 

Electronics Failure Analysis
Nondestructive TechniquesDestructive Techniques
Optical Microscopy (up to 2,000X)Cross-Sectional Analysis
3D X-Ray MicroscopyIon Chromatography
Scanning Electron MicroscopyDecapsulation/Delidding
Acoustic MicroscopyWire Bond Pull and Shear Testing
Thermal ImagingThermal Cycling
Fourier Transform Infrared (FTIR) SpectroscopyMechanical Testing (e.g., shock, vibration, bending, tensile, compression)
Laser-Induced Breakdown Spectroscopy (LIBS)Environmental Testing (e.g., thermal cycling, temperature-humidity bias (THB) testing)
Energy-Dispersive X-Ray Spectroscopy (EDS)Digital Image Correlation
Electrical CharacterizationDynamic Mechanical Analysis (DMA)
Electron Backscatter Diffraction (EBSD)Hardness Testing
Battery TeardownBattery Performance Testing

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