WHITE PAPER
How Multiphysics Simulation Enables 3D-IC Implementation at the Speed of Light
Electronic designers need greater integration densities and faster data transfer rates to meet the increased performance requirements of technologies like 5G/6G, autonomous driving, and artificial intelligence. The semiconductor industry is shifting toward 3D-IC design to keep up with the ever-growing demand for high-performance and power-efficient devices that has outpaced the capabilities of any single chip. 3D-IC technology refers to a range of packaging technologies for multi-die integrated circuits, in which multiple semiconductor chips — called “chiplets” — are placed close to each other (2.5D-IC) or stacked on top of each other (3D-IC).
Learn how chip designers are breaking down barriers to 3D-IC development with novel multiphysics simulation capabilities.
