Sign up for the last Magnetics & Consumer Electronics Design series webinar. Learn how Ansys Maxwell can provide a wealth of information to tackle complex EM computational challenges and the power of TDM in various applications. Learn how to scale computational resources efficiently.
Venue:
Virtual
Electronic components design and their integration on PCBs involve complex simulations to predict EM fields and forces accurately. These simulations can be computationally intensive and time-consuming. High-Performance Computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. The ECAD capability of Maxwell allows modeling and simulation of the PCB along with its components and interdependencies. This system-level simulation enables faster identification and resolution of design challenges.
PCB Designers, Consumer Electronics Engineers, Systems Engineers, Power Solutions Engineers, SI/PI Engineers, Product Design Engineers, Power Module Engineers
