Open Silicon Photonics 3D-IC Ecosystem for Computing Applications
Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology.
Ansys는 학생들에게 시뮬레이션 엔지니어링 소프트웨어를 무료로 제공함으로써 오늘날의 학생들의 성장을 지속적으로 지원하고 있습니다.
Ansys는 학생들에게 시뮬레이션 엔지니어링 소프트웨어를 무료로 제공함으로써 오늘날의 학생들의 성장을 지속적으로 지원하고 있습니다.
Ansys는 학생들에게 시뮬레이션 엔지니어링 소프트웨어를 무료로 제공함으로써 오늘날의 학생들의 성장을 지속적으로 지원하고 있습니다.
Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology.
Venue:
Virtual
We’ll highlight a collaborative project with HPE where Ansys HFSS and Ansys Lumerical INTERCONNECT were used with other Ansys tools for design scoping, optimization, and multiphysics analyses of an electronic-photonic 3D-IC transceiver for PCI express with co-packaged optics for data center applications. We’ll show signal and power integrity analyses’ results and how TSV configuration, package channel length, receiver-side equalization, and RDL densities achieved an overall system data rate of 384 Gb/s. On the photonics side, we will show a novel optimization technique and a workflow for thermal power budgeting in co-packaged optics.
3D-IC, 5G, and photonic design engineers