WEBINAR
How to Handle Underfill in Ansys Sherlock
Underfill materials are actively used to fortify printed circuit board (PCB) designs, to allow the PCBs to fulfill a plethora of applications and industry standards. From NASA’s space probe (Juno) to autonomous vehicles, underfill materials are present everywhere. While underfilling is a decades long technique, the materials implemented are continuously evolving in response to the growing needs of the electronics industry. New materials require extensive time and resources to fully characterize the mechanical properties and their influence on key components on an assembly.
To alleviate the need for some testing, simulation is used as a complementary effort to qualify material changes. Ansys Sherlock distinguishes itself as the only simulation tool used in the electronics industry to predict the success of underfill materials. This webinar demonstrates how Sherlock uses a combination of finite element analysis (FEA) and reliability physics to quantify the life of a product stressed by its field and test environments.
