结构分析软件
Ansys提供结构分析软件解决方案，使不同级别以及背景的工程师都能够快速高效地解决复杂的结构工程问题。借助我们的工具套件，工程师可以执行有限元分析（FEA），针对结构力学难题定制和自动化实现解决方案，并分析多种设计场景。通过在设计周期的早期阶段使用我们的软件，企业可以节省成本、减少设计周期的数量并加速产品上市进程。
结构
结构分析和仿真软件解决方案
Ansys结构
高级功能
借助我们综合全面的结构分析工具套件，工程师可以仿真冲击、跌落和振动、冲击和侵彻、撞击和碰撞、乘员安全、传热、焊接疲劳、重复性载荷等等。通过一系列应用和产品集成，Ansys结构分析可帮助您应对最棘手的产品挑战。
Cloud-based Engineering Simulation
Variation analysis and simulation orchestration
结构产品
January 2025
What's New
The 2025 R1 release of Ansys Structures introduces a suite of new features designed to provide holistic advantages to our customers.
Ansys Mechanical delivers powerful enhancements to solver capabilities, comprehension integration for NVH (noise, vibration, and harshness) applications, and advanced tools for material and crack growth analysis. These upgrades empower engineers to handle large, demanding models with improved accuracy, efficiency, and reliability across various industries.
- Advanced Solver Capabilities
- One-Stop-Shop for NVH
- Advanced Material and Crack Growth Analysis
Ansys LS-DYNA offers new solvers and methods that accurately describe real-world applications, from gas flows to adhesives and batteries.
- Introduction of Continuum Particle Gas (CPG)
- Enhanced Incompressible Smoothed Particle Galerkin (ISPG) Method
- Extended Multiphysics / Battery Capabilities
Ansys Sherlock offers new features centered around Thermal-Mech life predictions for BGA packages. In addition to PySherlock updates with new APIs and the automation of certain workflows.
- Thermal-Mech Life Predictions for BGA Packages
- PySherlock Updates and Automation
- Sherlock-Workbench and Sherlock Performance Enhancements
Ansys Sound offers new capabilities and enhancements with regards to psychoacoustics, Sound Power Level and the spectrum.
- Psychoacoustics Criteria in PyAnsys Sound
- Sound Power Level in SAS and PyAnsys Sound
- Generating Sound from Spectrum in SAS
Ansys Motion offers a new, single unified product for enhanced performance and added capabilities.
- Amplified Power / Single Product Packaging
- Improved Solver Speed and Accuracy
- Condensed Part Capabilities Enhancements
Webinars
功能
轻松应对您可能面临的各种复杂的设计环境，丰富的分析工具使您能够创建满足性能目标并具有耐用性的产品。
专题网络研讨会
On Demand Webinar
使用Ansys SIwave、Icepak、Mechanical和Sherlock对PCB进行电气和热可靠性分析
在本次网络研讨会中，了解如何使用Ansys SIwave、Ansys Icepak、Ansys Mechanical和Ansys Sherlock综合全面的多物理场解决方案优化PCB可靠性。
案例研究
了解Ansys提供的产品与服务
了解Ansys提供的产品与服务
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