Open Silicon Photonics 3D-IC Ecosystem for Computing Applications
Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology.
Ansys stellt Studierenden auf dem Weg zum Erfolg die Simulationssoftware kostenlos zur Verfügung.
Ansys stellt Studierenden auf dem Weg zum Erfolg die Simulationssoftware kostenlos zur Verfügung.
Ansys stellt Studierenden auf dem Weg zum Erfolg die Simulationssoftware kostenlos zur Verfügung.
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Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology.
Venue:
Virtual
We’ll highlight a collaborative project with HPE where Ansys HFSS and Ansys Lumerical INTERCONNECT were used with other Ansys tools for design scoping, optimization, and multiphysics analyses of an electronic-photonic 3D-IC transceiver for PCI express with co-packaged optics for data center applications. We’ll show signal and power integrity analyses’ results and how TSV configuration, package channel length, receiver-side equalization, and RDL densities achieved an overall system data rate of 384 Gb/s. On the photonics side, we will show a novel optimization technique and a workflow for thermal power budgeting in co-packaged optics.
3D-IC, 5G, and photonic design engineers