Thermal Analysis Software

Know how thermal energy will affect the efficiency, reliability and safety of your products.

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ANSYS APPLICATIONS

3D Thermal Analysis and Modeling

When a smartphone is held in a human hand. When a high-power circuit board is confined in a compact enclosure. When industrial equipment is exposed to extreme weather. Ansys thermal analysis solutions help engineers solve the most complex thermal challenges to predict how their designs will perform with temperature changes.

Account for temperature fluctuations
Prevent overheating issues
Improve product reliability across environments
Avoid multiple product prototypes and test failures
Minimize last minute design iterations
Improve collaboration between electrical and mechanical engineering teams

Find the right thermal simulation software for your use case

Thermal simulation provides deeper insights into a product’s behavior with different temperature scenarios, so engineers can see how their designs will be impacted by temperature changes. Knowing these outcomes enables teams to quickly adjust designs to achieve peak product performance.

Ansys simulations provide for a wide range of thermal management issues. Across industries and applications, many of these powerful solvers can be integrated through Ansys Workbench for accurate answers to virtually any thermal problem.

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Primary Thermal Applications

Electronics thermal simulation

Understand the thermal behavior of your electronic designs by simulating cooling strategies and overall thermal management for electronic assemblies within all types of products. See how each component’s response to heat and cold will affect overall performance.

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PCB thermal simulation

Identify thermal problems in printed circuit boards and integrated circuits to prevent degradation in performance of electronics devices across all industries: automotive, aerospace and defense, consumer electronics, healthcare and energy.

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Battery thermal simulation

Ensure a reliable and long-lasting battery by keeping it within its desired operating temperature range. Improve battery power and longevity while also identifying ways to reduce the size of batteries for engines and electronic devices.

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Structural analysis

Identify how temperature distribution can cause materials in your design to expand and contract. Test multiple scenarios to measure stresses and deformations caused by changes in temperature.

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Thermal Desktop

Software for heat transfer analysis, thermal radiation, environmental heating, and fluid flow design - the comprehensive two-phase flow capabilities make our software unique. It can produce analytical answers, and with the Advanced Design Module, becoming a component and system design tool that supports parametric studies, design optimization, and model correlation.

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Featured Products

Ansys Icepak

Electronics

A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.

Unstructured, body-fitted meshing
Built-in high-fidelity CFD solver
Comprehensive thermal reliability solution
Industry leading multiscale multiphysics
Board-level electrothermal coupling
Extensive libraries for thermal physics

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Ansys Fluent

FLUIDS

CFD-Software, die für ihre fortschrittliche physikalische Modellierung und für ihre branchenführende Genauigkeit bekannt ist.

Moderne, benutzerfreundliche Schnittstelle
Workflow in einem Fenster - von der Vor- bis zur Nachbearbeitung
Optimierte Vernetzungs- und Physik-Workflows
Erweiterte physikalische Modellierung
Effizientes Meshing und HPC-Skalierung des Solvers

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Ansys Mechanisch

STRUKTURMECHANIK

Lösen Sie umfassende Anforderungen an die Strukturanalyse mit einer Reihe von Finite-Elemente-Analyse (FEA)-Lösungen, die eine eingehende Analyse des Verhaltens von Strukturen und gekoppelten Feldern ermöglichen.

Benutzerfreundliches, vielseitiges Tool
Beständige, verlässliche Solver-Technologie
Dynamische, integrierte Plattform

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Free Trial

Ansys Sherlock

ELEKTRONIK

Bietet schnelle und genaue Lebensdauervorhersagen für elektronische Hardware auf Komponenten-, Platinen- und Systemebene in frühen Entwicklungsphasen, um das Design zukunftssicher zu machen.

Analyse der Lötermüdung
Übersetzt ECAD in Minutenschnelle in FEA/CFD
Umwandlung von Stress (thermisch, mechanisch) in Lebensdauervorhersage
Eingebettete, ausgefüllte, modifizierbare Bibliotheken
Validierte "Time-to-Failure"-Vorhersagen

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Ansys Maxwell

ELEKTRONIK

Ein Solver für die Simulation elektromagnetischer Felder für elektrische Maschinen und elektromechanische Geräte. Lösungen für statische, frequenzgebundene und zeitlich veränderliche elektrische Felder.

2D und 3D elektromagnetische FEA
Vom Bauteil zum System - Reduced-Order-Modellierung
Fortschrittliches elektromagnetisches Material
Automatisches adaptives Meshing
Multiphysikalische Analyse
Slice-Only-Technologie

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Ansys Slwave

Electronics

A specialized tool for simulating power and signal integrity as well as EMI analysis of IC/PCB packages. Solve for power delivery systems and high-speed channels in electronic devices.

Electrothermal and mechanical analysis
IBIS and IBIS-AMI SerDes analysis
Virtual compliance
Impedance, crosstalk and EMI scanning
Automated decoupling capacitor Optimization

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Ansys RedHawk-SC Electrothermal

Semiconductors

RedHawk-SC option for 3D/2.5D chip-package co-analysis
Power integrity analysis of coupled chip-package system
Thermal simulation
Identifies thermal-mechanical stress
Comprehensive early prototyping features
Integrated with board/system analysis tools

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Get help with your thermal challenges

Experts from the Ansys Customer Excellence (ACE) team are dedicated to helping you get the most from our thermal simulation software. The ACE team includes over 450 Ph.D.s who have solved a vast array of engineering simulation problems so they are well-equipped to help you overcome whatever challenges you are facing.

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Featured Resources

WEBINARS

Thermal Performance of Inverter Bus Bars with Complex Harmonic Content

Learn how multiphysics simulations can address key reliability requirements for automotive electronics with thermal thermal-aware EM and thermal-induced stress analyses.

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Discover Accurate and Efficient Thermal Analysis with the New AEDT Mechanical Integration

Import electromagnetic losses and set up and analyze thermal models of your electromagnetic designs with AEDT and Ansys Mechanical integration.

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Electro-Thermal Analysis Using Icepak in Ansys Electronics Desktop

With the native integration of Ansys Icepak into the Ansys Electronics Desktop, Ansys users can now benefit from a highly streamlined electromagnetic-thermal analysis workflow that promotes better collaboration between electrical and thermal engineers.

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Electrical and Thermal Reliability Analysis of PCB with Ansys SIwave, Icepak, Mechanical and Sherlock

In this webinar, learn how Ansys SIwave, Icepak, Mechanical and Sherlock can be used as a comprehensive multiphysics solution to optimize PCB reliability.

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BLOGS

By: Pavani Gottipati

Thermal Management in Wireless Charging: Challenges and Solutions

Read about the importance of thermal management in wireless charging and strategies to prevent overheating.

Read Blog

Thermal Degradation of Electronics: How Hot is Too Hot?

Thermal Management Systems: How Hot Is Too Hot?

Optimize Your PCB for Vibration, Shock and Thermal Environments

Thermal Cycling Failure in Electronics

What is Electronics Thermal Management?

WHITE PAPERS

White Paper

Ansys 5G Mobile/UE Solutions

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White Paper

Designing Next Generation Electric Powertrains Using CFD Simulation

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White Paper

Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages

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White Paper

Energy Efficient IoT-Based Smart Home

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CASE STUDIES

Ansys + KTM MotorCross

In the spirit of no-trace off-road adventure, KTM, a European motorcycle manufacturer, is focused on taking electrification to the trails with its E-Ride dirt bike. With support from Ansys’ channel partner CADFEM, KTM leveraged Ansys Twin Builder and Ansys Mechanical to develop a simulation workflow and a full 3D model useful in the virtual design, validation, and verification of a traction battery with optimized thermal properties.

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Creotech Instruments Creates Next-Generation Microsatellites with Multiphysics Simulation

Learn how Ansys multiphysics simulation helped Creotech create virtual prototypes of satellite components, modules and subsystems, enabling their engineers to analyze designs and verify their expected operation.

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Continental Investigates the Effect of Solder Geometry and Board Boundry Conditions on Solder Thermal Fatigue

Using Ansys Sherlock, Continental was able to identify the solder geometry and board boundary conditions that yielded the lowest probability of failure.

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ARTICLES

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