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Failure Modes in Conductive Adhesives
By Petri Savolainen
Conductive adhesives offer lead-free, low temperature attachment for various types of electronics applications. They are composite materials consisting of a polymer matrix (adhesion, strength) and conductive filler (electric conductivity). Due to the nature of polymers, it is relatively easy to tailor adhesive properties to match specific requirements. Selection of the filler depends on the application.
