In today’s fast-paced engineering landscape, designing superior products quickly is more critical than ever. Engineers are constantly faced with complex challenges — whether it’s accelerating simulation times, managing increasingly intricate models, or optimizing design workflows to meet tight deadlines. At Ansys, we understand these demands, and through our suite of partner-augmented solutions, we’re empowering innovation by leveraging the latest in high-performance computing (HPC), artificial intelligence (AI), and tailored hardware systems.
As highlighted in our previous blog, Ansys remains at the forefront of innovation, driving advancements in HPC and AI. This year, at Supercomputing 2024 (SC24), we’re not only showcasing our cutting-edge technology but demonstrating how our collaborative approach with top-tier partners like NVIDIA, Supermicro, and others is transforming simulation for the next generation of product development.
Ansys optiSLang process integration and design optimization software can be used to mathematically determine the best shape for product requirements.
Accelerating Simulation Through Turnkey Hardware Solutions
One of the most daunting tasks for engineering teams is selecting and configuring the ideal hardware solution for their simulation needs. A one-size-fits-all approach simply doesn’t work when dealing with diverse applications like Ansys Fluent fluid simulation software, Ansys LS-DYNA nonlinear dynamics structural simulation software, Ansys Mechanical structural finite element analysis software, and Ansys HFSS high-frequency electromagnetic simulation software. That’s why we’ve developed NVIDIA-powered Supermicro systems optimized specifically for Ansys’ multiphysics applications.
These turnkey systems are designed to help engineers accelerate simulations and tackle larger, more complex models with unprecedented speed and efficiency. By streamlining hardware configuration, Ansys and its partners empower users to focus on design exploration and optimization rather than becoming bogged down by infrastructure setup.
For a deeper dive into how these solutions can transform your workflow, download our exclusive e-book “How To Accelerate Simulation Software With Turnkey Hardware Systems.” This e-book reveals how hardware can accelerate simulation tasks by four to 1,600 times, boosting engineering productivity and significantly shortening time to market.
Transforming Simulation Through AI
As product development cycles shorten and the demand for faster innovation grows, the integration of AI into simulation workflows offers unprecedented opportunities. Simulation has long been a vital tool for optimizing designs, but AI presents a chance to revolutionize these processes, making them faster, smarter, and more accessible. Ansys is at the forefront of this transformation by combining our industry-leading multiphysics simulation tools with physics-informed generative AI and HPC, all through a cloud-based platform.
At SC24, Ansys will showcase the Ansys SimAI cloud-enabled generative AI platform, which enables users to predict design performance in minutes, testing 10 to 100 times more design alternatives without traditional solver constraints. The platform’s ease of use empowers both engineers and novices. Attendees will also see Ansys AI+, a solution that enhances simulation accuracy with advanced machine learning across various physics, providing deeper insights and more detailed results.
Additionally, join us at SC24 for an exclusive HPC + AI roundtable discussion where industry leaders, researchers, and innovators will explore the transformative potential of AI and HPC in engineering simulations and beyond. This roundtable provides a unique opportunity to engage with peers, share challenges and solutions, and discuss how AI and HPC can revolutionize your innovation journey.
Join Ansys at Supercomputing 2024 (SC24), and register for an exclusive HPC + AI roundtable discussion.
Empowering Scalable, Cost-effective HPC Deployments With Tailored Partner Solutions
Navigating the complexities of HPC deployments — whether on-premises or in the cloud — can be overwhelming for many companies. High upfront costs, rapid technological changes, and integration challenges all add layers of complexity. However, Ansys simplifies this process by working closely with industry-leading hardware and cloud providers to deliver flexible, scalable, and cost-effective HPC solutions.
At Ansys, we understand that every organization’s needs are different. That’s why we offer a range of deployment options tailored to fit your unique requirements. Whether you need the scalability of cloud-based HPC or the reliability of on-premises infrastructure, our partnerships with leading HPC vendors and cloud service providers give you the freedom to choose the best solution for your business.
By simplifying the adoption and deployment of HPC, we enable companies to leverage the full potential of scalable computing power, allowing them to run complex simulations more efficiently and cost-effectively.
With Ansys Cloud solutions, you can rapidly access public computing resources to power your simulations and expedite the product design process. The Cloud Marketplace’s Bring Your Own Cloud (BYOC) options allow customers to quickly deploy Ansys applications in their own cloud environments, using both their existing Ansys and third-party licenses. This provides a cost-effective way to scale simulation workloads in the cloud, leveraging established relationships with Amazon Web Services (AWS) and Microsoft Azure.
What’s Next: Join Us at SC24
Our upcoming presence at SC24 will provide a deeper dive into how our solutions are transforming the simulation landscape. SC24 attendees can explore how Ansys, in collaboration with industry-leading partners, is pushing the boundaries of HPC and AI for a wide array of engineering applications.
Join Rongguang Jia, distinguished engineer at Ansys, as he presents groundbreaking developments in graphics processing unit (GPU) computing strategies for Fluent software. Jia will dive into how these advancements are driving efficiency and performance gains for Fluent applications.
Additionally, don’t miss Jeff Beisheim, senior principal R&D engineer at Ansys, as he highlights AMD’s expanding support in Mechanical applications. Beisheim will showcase significant improvements in simulation performance and robustness on clusters and servers powered by AMD EPYC CPUs, demonstrating the transformative impact of these technologies on large-scale simulations.
We’ll also be featuring presentations from other HPC and cloud partners, showcasing Ansys performance results on the latest CPU and GPU architectures, including the much-anticipated NVIDIA Grace Hopper superchip, as well as AMD Turin and Intel Granite Rapids CPUs.
If you’re ready to take your simulations to the next level, make sure to join us at SC24 in Atlanta from Nov. 17 to 22 or attend our upcoming webinar for a firsthand look at the innovations shaping the future of HPC and AI-enabled simulation.
Read more about or register for SC24. We look forward to empowering your innovation journey.
