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Ansys RedHawk-SC Security

Side-Channel Leakage Analysis and Security Sign-off

RedHawk-SC Security is the industry's first EDA solution for pre-silicon hardware security verification addressing power, power-noise, electromagnetic, and other multiphysics side-channel leakage vulnerabilities.

EDA solution to security verification from RTL power to layout-level emissions

RedHawk-SC Security features RTL/gate power, layout-level power-noise, electromagnetic, and Multiphysics simulation for fast side-channel trace generation and security analytics. Given the physical design database of the chip, you can virtually probe on-die and off-chip emissions to pinpoint spatial and temporal side-channel leakage to prioritize physical design mitigations. It leverages the innovative SeaScape data platform to complete massive time-domain simulation with a much faster turn-around time than post-silicon validation.

  • RTL/Gate Power Analysis
    RTL/Gate Power Analysis
  • On-die power noise analysis
    On-die power noise analysis
  • Near-field electromagnetic analysis
    Near-field electromagnetic analysis
  • Side channel leakage analysis (SCLA)
    Side channel leakage analysis (SCLA)
  • Cybersecurity Vulnerability prevention
    Cybersecurity Vulnerability prevention
Semiconductor Security

Quick Specs

As an advanced option of Ansys RedHawk-SC, RedHawk-SC security leverages Multiphysics solvers to simulate power, on-chip power-noise, near-field electromagnetic emission, and thermal profiling traces with up to billion cycles for data leakage assessment. It enables chip side-channel leakage analysis and security sign-off solutions for security architects, RTL design, and physical design verification engineers.

  • Side-Channel trace generation
  • Long vector handling
  • Build-in security analytics
  • Big-data Architecture
  • EMI/EMC
  • Chip Security Sign-off Metrics
  • Power, noise, and EMAG detection

Hardware Security Solution with Pre-silicon Side-channel Leakage Analysis

How RedHawk-SC Security assess and quantify side channel leakage vulnerabilities

Semiconductor Security

Minimize a chip’s vulnerability to side-channel analysis and the risk of exposing confidential data

Data security and privacy are essential concerns for mission-critical components in many electronic systems today. Automotive, financial, 5G and IoT devices use modern cryptography to ensure information security; it can be compromised by exploiting vulnerabilities in the physical implementation of underlying integrated circuits (ICs). Side-channel leakage analysis (SCLA) is a technique to extract sensitive information from sub-optimally protected hardware by probing various physical phenomena. As ICs cannot be altered in the field, verifying side-channel countermeasures in the pre-silicon design stage is essential. Our Multiphysics simulation enables system-on-chip (SoC) design teams (without hardware security background) to predict and quantify design vulnerabilities for side-channel analysis and assess the effectiveness of the design countermeasures.

Pre-silicon sign-off flow for hardware security and anti-tampering verification

RedHawk-SC Security simulates Multiphysics side-channel emissions at different design abstraction levels, giving a complete picture of a given IC design’s security risks as part of a more extensive electronics architecture. This powerful solution features a fast, billion-cycle power profile simulator that assesses the most complex side-channel metrics within a few hours. 

Key Features

Ansys RedHawk-SC Security features the industry-golden Multiphysics solvers to tackle the simulation challenges of hardware security/safety verification.

Ansys RedHawk-SC Security utilizes the parallel computing architecture of Seascape that makes it fast and easy to build an accurate electrical model for SCLA

RedHawk-SC Security uses a novel algorithm to generate a security-critical side channel probing configuration based on a security-aware switching scenario, accounting for millions of vector cycles.

Patented technology to simulate off-chip emission created by on-chip power noise to assess near-field electromagnetic side-channel leakage.

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