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Ansys HFSS-IC 

Chip to System Electromagnetics Simulation Software

Seamlessly design and simulate multiscale electronics from IC to package up to system, all from within the multiphysics, open and extensible Electronics Desktop platform.

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PRECISION MEETS ELECTRONICS INNOVATION

Unlock the Power of High Performance Multiscale Design with Ansys HFSS-IC

Ansys HFSS-IC provides a unified platform for signal and power integrity analysis of heterogeneous IC-to-systems design. Its seamless co-design and co-simulation capabilities bridge the gap between IC and package/system designers, enabling early in-design insights. This ultimately expedites the time-to-market delivery of foundry-certified designs with gold-standard accuracy for sign-off.

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    Multiscale electromagnetic extraction
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    Fast IC electromagnetic extraction
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    Fast RLCG model extraction
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    Gold standard accuracy
HFSS-IC Overview

Product Specs

Manage the increasing complexity, multiphysics, cross-team collaboration, and integration requirements for electronic technologies such as RFICs, 3DICs, advanced packaging, and more. HFSS-IC breaks down silos and enables high-fidelity, high-performance IC-package systems co-design and co-simulation. 

  • HFSS for gold-standard accuracy
  • RaptorX for foundry-certified IC designs
  • Q3D for rapid RLCG extraction
  • Advanced node support
  • Layout-dependent effects
  • Unified design environment
  • Signal/power integrity sign-off
  • Python automation API
  • HPC/Cloud Scalability

Versatile and Scalable IC to Systems Electronics Design

Ansys HFSS-IC unifies the power of the industry’s three best-in-class electromagnetic solvers – HFSS, RaptorX, and Q3D – into one design environment. Ansys HFSS-IC expedites the time-to-market delivery of foundry-certified designs with gold-standard accuracy for sign-off.

HFSS-IC Capabilities

 

Key Features

HFSS-IC bundles 3 golden electromagnetic solvers for chip to system design: HFSS, RaptorX and Q3D.

  • Signal and power integrity analysis
  • Advanced packaging design
  • Chip to system assembly sign-off

Designing for good signal and power integrity is a multi-step process that often requires importing and exporting data from one tool to another. HFSS-IC offers access to multiple industry-leading EM extraction tools in one design interface and a circuit solver to complete the simulation-based workflow.  

The Ansys Electronics Desktop Platform now has a design mode tailored for IC design work. In this mode, designers can access all the HFSS-IC solver technologies (HFSS, RaptorX, and Q3D) to perform fast and accurate electromagnetic extraction of die and interposer designs from DC to high frequency for signal and power integrity analysis.

Leverage IC mode in Electronics Desktop for automated translation and simplification of the design, fast and accurate extraction, and advanced post-processing capabilities that help you design first-time-right interposers for 2.5 and 3D IC design. 

3DIC design brings a new simulation challenge: how can the entire chip be modeled to the package system and ensure no undesirable electromagnetic coupling occurs between various components in the assembly? HFSS has advanced usability and automation features that streamline the assembly of multiscale, heterogeneous designs. Once assembled, engineers will use HFSS Mesh Fusion and HPC to obtain timely gold standard accurate model extractions for signal and power integrity analysis. Create a dynamic link between HFSS and the circuit to push transient excitations and visualize 3D fields in the full system to obtain next-level design insights and confidently innovate.

Ansys software is accessible

It's vital to Ansys that all users, including those with disabilities, can access our products. As such, we endeavor to follow accessibility requirements based on the US Access Board (Section 508), Web Content Accessibility Guidelines (WCAG), and the current format of the Voluntary Product Accessibility Template (VPAT).

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