Seamlessly design and simulate multiscale electronics from IC to package up to system, all from within the multiphysics, open and extensible Electronics Desktop platform.
Ansys HFSS-IC provides a unified platform for signal and power integrity analysis of heterogeneous IC-to-systems design. Its seamless co-design and co-simulation capabilities bridge the gap between IC and package/system designers, enabling early in-design insights. This ultimately expedites the time-to-market delivery of foundry-certified designs with gold-standard accuracy for sign-off.
Manage the increasing complexity, multiphysics, cross-team collaboration, and integration requirements for electronic technologies such as RFICs, 3DICs, advanced packaging, and more. HFSS-IC breaks down silos and enables high-fidelity, high-performance IC-package systems co-design and co-simulation.
Ansys HFSS-IC unifies the power of the industry’s three best-in-class electromagnetic solvers – HFSS, RaptorX, and Q3D – into one design environment. Ansys HFSS-IC expedites the time-to-market delivery of foundry-certified designs with gold-standard accuracy for sign-off.
HFSS-IC bundles 3 golden electromagnetic solvers for chip to system design: HFSS, RaptorX and Q3D.
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