Ansys Q3D Extractor
Multiphysics Parasitic Extraction & Analysis

3D Quasi-static Field Solver

Ansys Q3D Extractor contains an advanced quasi-static 3D electromagnetic field solver based on the method of moments (MoM), and is accelerated by the fast multipole method (FMM). Results include proximity and skin effect, dielectric and ohmic loss, and frequency dependencies. Q3D Extractor easily and quickly provides 3D extraction of resistance (R), partial inductance (L), capacitance (C) and conductance (G).

2D Extractor: Cable and Transmission Line Field Solver

Ansys Q3D Extractor includes a powerful quasi-static 2D electromagnetic field solver that uses the finite element method (FEM) to determine the per-unit-length RLCG parameters for cable models, transmission lines, characteristic impedance (Z0) matrices, propagation speed, delay, attenuation, effective permittivity, differential and common-mode parameters, and near- and far-end crosstalk coefficients

Automatic adaptive meshing techniques require you to specify only geometry, material properties and the desired output. The meshing process uses a highly robust volumetric meshing technique and includes a multithreading capability that reduces the amount of memory used and accelerates time to simulation. This proven technology eliminates the complexity of building and refining a finite element mesh and makes advanced numerical analysis practical for all levels of your organization.

Parametric analysis

• User-specified range and number of steps for parameters
• Automatic analysis of parameter permutations
• Automated job management across multiple hardware platforms and reassembly of data for parametric tables and studies

Optimization

• User-selectable cost functions and goal objectives, including:
• Quasi-Newton method
• Sequential nonlinear programming (SNLP)
• Integer-only sequential nonlinear programming

The ability to generate highly accurate reduced-order SPICE models for use in circuit simulation makes Ansys Q3D Extractor the ideal software to create IBIS package models. You can study crosstalk, ground bounce, interconnect delays and ringing, which helps you to understand the performance of high-speed electronic designs, such as multilayer printed circuit boards, advanced electronic packages and 3D on-chip passive components. In addition, Q3D Extractor is essential for extracting accurate electrical parasitics of critical interconnect components in the package (bondwires), on the board (critical nets), and for the connection path between the chip, package and board (i.e., connectors, cables, sockets and transmission lines).

You can leverage Ansys Q3D Extractor to create equivalent circuit models (SPICE subcircuits/ladder-type lumped models). The type of model that Q3D Extractor produces depends on which solver was used. The 2D and 3D field solvers create common formats such as Simplorer SML, HSPICE Tabular W-Element, PSpice, Spectre, IBIS ICM/PKG models and Ansys CPP models.

With Q3D Extractor, you can solve design challenges by analyzing the RLCG matrix data of touchscreen devices. The ability to efficiently solve thin conductive layers, such as ITO, can accelerate solutions up to 22 times over traditional thick metal solution methods.