Overview
This Ansys 2024 R1 webinar will review the high-frequency electronics tool updates, enhancements, and new features – HFSS, Q3D, SIwave, and NuHertz. Engineers developing PCBs, antennas, and other RF capabilities for telecommunications, HPC, automotive, A&D, and IoT applications will find many new capabilities and improvements in this update.
What you will learn
- Encrypted technology file support in HFSS 3D Layout IC Mode
- Enhanced support for FlexPCB in HFSS 3D
- HFSS Finite Array metadata export and mask automation
- Icepak Thermal Mesh Fusion
- Solver enhancements for SIwave and Q3D
- Improvements to HPC/Distributed Computing support for all products
Who should attend and why
Engineers involved in new product development for any electronics market
Speaker