Technical Paper
Fostering Thermal Design Innovation using Chip-Package-System Analysis Techniques
This paper outlines the Ansys design flow to dissipate heat within electrical packages and PCB's.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
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