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Ansys at Supercomputing24 (SC24)

Experience Ansys expertise in pervasive engineering simulation solutions spanning HPC, accelerated computing, and AI. Stop by Ansys booth #2741 to engage with our experts, catch an Ansys theater session, or participate in a customer roundtable. 

Dates: 
November 17-22, 2024

Georgia World Congress Center

Cutting-Edge HPC and AI: Shaping the Future of Engineering Simulation

Join us at SC24 to discover how Ansys revolutionizes engineering simulation with cutting-edge HPC and AI solutions. Explore our high- performance computing capabilities—whether CPU or GPU enabled, on-premises or in the cloud—enhanced by AI. Witness our top solvers’ latest HPC benchmarking results across diverse hardware configurations, including Fluent, LS- DYNA, Mechanical, HFSS, and more.

Throughout the week of SC24, Ansys will feature in-booth panel and theater sessions, hands-on experiences, networking opportunities, and presentations from Ansys Technology Partners including AMD, AWS, HPE, Intel, Microsoft and NVIDIA.

Don’t miss this opportunity to see firsthand how Ansys, supported by our partners, drives performance and innovation in engineering simulation.

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HPC Solutions by Ansys

We provide scalable HPC solutions that allow engineers to perform more high-fidelity simulations on multicore computers in less time. These simulations can be more extensive, complex, and accurate than ever.

Bring Your Own Cloud

We offer cloud-based solutions that provide easy access to high-performance computing (HPC) resources for engineering simulations.

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Ansys AI: Transforming Simulation

AI-augmented simulation technology revolutionizes engineering, bringing unprecedented speed, innovation, and accessibility.

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HPC + AI Roundtable

Join us for an exclusive roundtable discussion where industry leaders, researchers, and innovators will converge to explore the transformative potential of AI and HPC in engineering simulations and beyond. This roundtable – hosted by Ansys at SC’24 in Atlanta – is a unique opportunity to engage with peers, share challenges and solutions, and shape the future of your enterprise with cutting-edge technology. Don't miss this chance to discuss how AI and HPC can be the game-changers in your innovation journey.

Date: November 19, 4:00-6:00pm 

Venue:

HYATT REGENCY ATLANTA
265 Peachtree St. NE, Atlanta, GA 30303, USA
Meeting Room: Embassy H

Agenda

TimeTopic
4:00pmWelcome & Introductions
4:10pmHPC & AI Vision and Strategy for Engineering Simulation: Introduction to the Ansys strategy related to HPC and AI deployment, incl. support for centralised HPC, public cloud, VDI, PyAnsys, ML platform, and some real-world applications and case studies demonstrating the impact of AI and HPC on product development.
4:45pmBreak
5:00pmRoundtable Discussion: This group discussion will focus on democratization of HPC & AI, infrastructure requirements, licensing, and other keys to optimising enterprise access to HPC and AI data centre resources managed internally and/or on the public cloud.
5:45pmGeneral Discussion & Action Items for Ansys
6:00pmClosure

Ansys Booth Theater Schedule

Day/ Time

Abstract

Presenter Name & Title

Tuesday: 10:30am-11:00am

Pushing the Engineering Limits Thanks to HPC and Cloud with Ansys and Microsoft Azure

Ansys Access on Microsoft Azure is a new offering available on the Azure Marketplace, enabling customers to run simulations in their own Azure subscription (BYOC) and using their existing licenses (BYOL). This new offer allows customers to use their existing Ansys applications and Azure services purchased directly from Microsoft to deliver cost savings, improved data management, and greater flexibility. 

Attend this live session to learn more about: 

What is Ansys Access on Microsoft Azure™ and why adopting a cloud hybrid approach could be a game changer for your business.

Latest advancements with HPS – HPC Platform Services

Our latest performances results and benchmarks for both CPUs and GPUs. 

JJ Jones, Global Cloud Business Development Manager, Ansys
John Baker, Cloud Business Development Manager (EMEA), Ansys

Tuesday: 12:00-12:30pm

Liquid Cooling: The Future of Thermal Management for High-Density Electronics

Liquid cooling for electronics has emerged as a vital solution for managing thermal challenges in high-performance computing, data centers, and compact electronic devices. The advantages of liquid cooling include superior heat transfer capabilities compared to traditional air cooling, enabling lower operating temperatures, higher performance, and increased reliability of electronic systems. It also reduces noise levels associated with high-speed fans, making it ideal for noise-sensitive environments.
As electronic devices continue to evolve in terms of power density and thermal output, liquid cooling stands out as a promising technology that ensures optimal thermal management and supports the demands of modern computing applications.
This presentation will provide a comprehensive overview of Ansys solutions for liquid cooling starting from the component level to data center level modeling

Harish Kanchi, Manager Application Engineering, Ansys

Tuesday: 12:30pm-1:00pm

Accelerated Reordering

Sparse matrix factorization is frequently the main computational bottleneck in implicit mechanical computer-aided engineering (MCAE).  Minimizing the operations and storage required to factor these sparse matrices is NP-complete, so the nested dissection heuristic is commonly used to reduce these demands. Nested dissection is a recursive process that finds balanced min-cut partitions within the graph representing the sparse matrix’s non-zero structure, an NP-hard problem itself. A new generation of accelerators is being developed for addressing NP optimization problems.  In this talk, we share our experiences using the LightSolver Laser Processing Unit to address the reordering of sparse matrices, and its potential to reduce run times and improve the scalability of implicit mechanical simulations.

Robert Lucas, Ansys Fellow, Ansys
Ruti Ben-Shlomi, CEO, LightSolver

Tuesday: 1:30pm-2:00pm

Achieving More Compute Power with Cloud and HPC Thanks to Ansys and Amazon Web Services

Ansys Gateway powered by AWS is the solution for developers, designers, and engineers who want to manage their complete Ansys Simulation & CAD/CAE developments in the cloud. Access cloud computing resources from anywhere on virtually any device via your web browser. You can create, customize, and connect cloud applications with minimal technical skills.  Simply install your 3rd party applications alongside Ansys applications and Bring Your Own Ansys Licenses (BYOL). ttend this live session to learn more about: 

What is Ansys Gateway powered by AWS™ and why adopting a cloud hybrid approach could be a game changer for your business.

Learn from our latest customer success stories including Cycling Team Groupama FDJ , Turntide, Emirates Team New Zealand, MPR Associates, ACWA Robotics..

Our latest performances results and benchmarks for both CPUs and GPUs. 

JJ Jones, Global Cloud Business Development Manager, Ansys
John Baker, Cloud Business Development Manager (EMEA), Ansys

Tuesday: 3:00pm-3:30pm

Advancements in Sustainable HPC Solutions for Ansys Applications

AMD and HPE will address the complex simulation challenges faced by our enterprise CAE customers. This session will focus on the deployment of highly efficient high-performance computing (HPC) clusters, power management options, advanced storage systems, and robust data management solutions. With customers relying on advanced modeling and simulation as a key business function, it’s important to choose HPC systems that optimize performance for a wide range of applications. Additionally, as thermal and power management become increasingly critical in next-generation HPC systems, customers need to understand the advantages of liquid cooling technology.
Join us to also hear about the latest performance results of AMD EPYC™ processors running Ansys CFX, Ansys Fluent, Ansys Mechanical, and Ansys LS-DYNA, demonstrating their capabilities in real-world applications.

Tony Devarco Director, HPC/AI and Manufacturing, HPE
Rick Knoechel, Global Strategy Lead – Automotive & Discrete Mfg.
Strategic Market Development Group – Server BU, AMD

Tuesday: 3:30pm-4:00pm

Ansys Fluent Delivers Significant Performance Gains and Cost Savings with NVIDIA GPUs on Oracle Cloud Infrastructure

Fluent® is an industry leading Computational Fluid Dynamics (CFD) package used world-wide on a variety of applications. While Fluent has been highly optimized for traditional CPU based High Performance Computing (HPC) systems, the latest release, version 2024 R2, has been written to fully harness NVIDIA Tensor Core GPU acceleration for CFD workloads. This talk discusses the advantages offered by Fluent, accelerated by NVIDIA GPUs, at Oracle Cloud Infrastructure (OCI).

Mike Barry, HPC Specialist, Oracle
Martin Feyereisen, Master Cloud Architect, Oracle

Wednesday: 10:00am-10:30am

Achieving More Compute Power with Cloud and HPC Thanks to Ansys and Amazon Web Services

Ansys Gateway powered by AWS is the solution for developers, designers, and engineers who want to manage their complete Ansys Simulation & CAD/CAE developments in the cloud. Access cloud computing resources from anywhere on virtually any device via your web browser. You can create, customize, and connect cloud applications with minimal technical skills.  Simply install your 3rd party applications alongside Ansys applications and Bring Your Own Ansys Licenses (BYOL). ttend this live session to learn more about: 

What is Ansys Gateway powered by AWS™ and why adopting a cloud hybrid approach could be a game changer for your business.

Learn from our latest customer success stories including Cycling Team Groupama FDJ , Turntide, Emirates Team New Zealand, MPR Associates, ACWA Robotics..

Our latest performances results and benchmarks for both CPUs and GPUs. 

JJ Jones, Global Cloud Business Development Manager, Ansys
John Baker, Cloud Business Development Manager (EMEA), Ansys

Wednesday: 10:30am-11:00am

Advancements in Sustainable HPC Solutions for Ansys Applications

AMD and HPE will address the complex simulation challenges faced by our enterprise CAE customers. This session will focus on the deployment of highly efficient high-performance computing (HPC) clusters, power management options, advanced storage systems, and robust data management solutions. With customers relying on advanced modeling and simulation as a key business function, it’s important to choose HPC systems that optimize performance for a wide range of applications. Additionally, as thermal and power management become increasingly critical in next-generation HPC systems, customers need to understand the advantages of liquid cooling technology.
Join us to also hear about the latest performance results of AMD EPYC™ processors running Ansys CFX, Ansys Fluent, Ansys Mechanical, and Ansys LS-DYNA, demonstrating their capabilities in real-world applications.

Tony Devarco, Director, HPC/AI and Manufacturing, HPE
Rick Knoechel, Global Strategy Lead – Automotive & Discrete Mfg.
Strategic Market Development Group – Server BU, AMD

Wednesday: 11:00am-12:00pm

Panel Discussion: Cloud Computing for Engineering Simulation

The panelists will explore the multifaceted impact of cloud computing on engineering simulations, covering both the technical opportunities and strategic considerations that come with leveraging cloud platforms for this purpose.

The discussion will also focus on the benefits, challenges, and best practices for leveraging cloud-based and hybrid HPC solutions to optimize engineering simulations.

This interactive session will offer insights into the strategic advantages of cloud-based and hybrid HPC solutions, practical tips for optimizing engineering simulations with AI and cloud-native technologies, and best practices for managing data security and compliance in diverse cloud environments.

Panel Lead:
Andy Byers, Director Strategic Cloud Partnerships, Ansys
Panelists:
Avi Kulkarni, Global Business Development and GTM, Accelerated Compute, AWS
Derek McCoy, Head of Channel, Enterprise, and Public Sector, Rescale
Andy Chan, Principal Product Manager, NetApp

Wednesday: 12:00pm-12:30pm

Pushing the Engineering Limits thanks to HPC and Cloud with Ansys and Microsoft Azure

Ansys Access on Microsoft Azure is a new offering available on the Azure Marketplace, enabling customers to run simulations in their own Azure subscription (BYOC) and using their existing licenses (BYOL). This new offer allows customers to use their existing Ansys applications and Azure services purchased directly from Microsoft to deliver cost savings, improved data management, and greater flexibility. 

Attend this live session to learn more about: 

What is Ansys Access on Microsoft Azure™ and why adopting a cloud hybrid approach could be a game changer for your business.

Latest advancements with HPS – HPC Platform Services

Our latest performances results and benchmarks for both CPUs and GPUs. 

JJ Jones, Global Cloud Business Development Manager, Ansys
John Baker, Cloud Business Development Manager (EMEA), Ansys

Wednesday: 12:30pm-1:30pm

Azure NetApp Files, Boosting HPC Productive with Innovation

In this session, we will explore the pivotal role of file systems in optimizing High-Performance Computing (HPC) at an Azure scale, utilizing tens of thousands of compute cores working in unison to tackle the most advanced HPC challenges. The key solution is Azure NetApp Files (ANF), which Microsoft Azure customers such as AMD are leveraging with remarkable efficacy today. Thanks to ANF’s low latency, high throughput, and simplified management, users are experiencing significant productivity gains by eliminating the hardware constraints traditionally associated with running HPC workloads

Andy Chan, Principal Product Manager, NetApp

Wednesday: 1::00pm-1:30pm

Leveraging AI for Engineering Simulation

The presentation will cover Ansys AI solutions for Design and Digital Twins, how we are leveraging language models to improve customer user experience, and the impact of AI on the numerical capabilities of our traditional simulation products.

Ilya Tolchinsky. Lead Product Manager, Ansys

Wednesday: 1:30pm-2:00pm

High Performance Scalable Infrastructure Running Ansys Fluent and Ansys Mechanical

To achieve high performance and scalability, a high performance 200Gbps network, modular CPU rack servers, and fast NVMe storage fabric are essential. This advanced infrastructure significantly boosts the performance of Ansys Fluent and Ansys Mechanical, enabling large-scale data and complex simulations.

Waiming Mok, Director, Product, Supermicro

Wednesday: 2:30pm-3:00pm

Enhancing Ansys’ CAE End-to-End Workflows Using NVIDIA Technologies

Today’s CAE workflow truly needs to be accelerated in order to tackle increasingly complex and detailed simulations more quickly and accurately. In this session, we will showcase how Ansys, by adopting best-in-class NVIDIA technologies, is enabling its customers to drive down development costs and energy usage while achieving faster time to market. We will highlight Ansys portfolios like Ensight, LS-Dyna, Fluent, RedHawk SC and how various NVIDIA technologies like Grace and Grace-hopper, physics-AI and Omniverse have enhanced these portfolios to enable Ansys’ end customers for achieve interactive, real-time analysis.

Bhoomi Gadhia, Sr. Product Marketing Manager, NVIDIA

Wednesday: 3:00pm-3:30pm

Panel Discussion: Future Trends in HPC for Engineering Simulation

The panelists will explore the emerging technologies and architectures that are set to shape the future of HPC in engineering simulation, including accelerated computing, sustainable computing, and the advent of exascale computing.

The discussion will also focus on reducing the environmental impact of HPC, covering topics such as energy-efficient hardware design, low-power processors, and the development of green data centers.
This interactive session will offer valuable insights into the latest trends and challenges in HPC for engineering simulation, encouraging panelists to discuss both the technical advancements and the broader implications of these innovations.

Panel Lead:
Wim Slagter, Director Partner Programs, Ansys

Panelists:
Baskar Rajagopalan – Director, Manufacturing, NVIDIA
Pete Bradley – Principal Fellow, Pratt & Whitney
Rick Knoechel – Global Strategy Lead, Automotive & Discrete Mfg., AMD
Tony DeVarco – Director, HPC/AI and Manufacturing Vertical, HPE

Thursday: 10:30am-11:00am

Advancements in Sustainable HPC Solutions for Ansys Applications

AMD and HPE will address the complex simulation challenges faced by our enterprise CAE customers. This session will focus on the deployment of highly efficient high-performance computing (HPC) clusters, power management options, advanced storage systems, and robust data management solutions. With customers relying on advanced modeling and simulation as a key business function, it’s important to choose HPC systems that optimize performance for a wide range of applications. Additionally, as thermal and power management become increasingly critical in next-generation HPC systems, customers need to understand the advantages of liquid cooling technology.
Join us to also hear about the latest performance results of AMD EPYC™ processors running Ansys CFX, Ansys Fluent, Ansys Mechanical, and Ansys LS-DYNA, demonstrating their capabilities in real-world applications.

Tony Devarco, Director, HPC/AI and Manufacturing, HPE
Rick Knoechel, Global Strategy Lead – Automotive & Discrete Mfg.
Strategic Market Development Group – Server BU, AMD

Thursday: 11:00am-11:30am

Achieving More Compute Power with Cloud and HPC Thanks to Ansys and Amazon Web Services

Ansys Gateway powered by AWS is the solution for developers, designers, and engineers who want to manage their complete Ansys Simulation & CAD/CAE developments in the cloud. Access cloud computing resources from anywhere on virtually any device via your web browser. You can create, customize, and connect cloud applications with minimal technical skills.  Simply install your 3rd party applications alongside Ansys applications and Bring Your Own Ansys Licenses (BYOL). ttend this live session to learn more about: 

What is Ansys Gateway powered by AWS™ and why adopting a cloud hybrid approach could be a game changer for your business.

Learn from our latest customer success stories including Cycling Team Groupama FDJ , Turntide, Emirates Team New Zealand, MPR Associates, ACWA Robotics..

Our latest performances results and benchmarks for both CPUs and GPUs. 

JJ Jones, Global Cloud Business Development Manager, Ansys
John Baker, Cloud Business Development Manager (EMEA), Ansys

Thursday: 11:30am-12:00pm

Optimizing Ansys LS-DYNA Simulation Costs by Running Multiple Job Containers with NUMA Affinity on a Single VM

Simr, formerly UberCloud, is a SimOps or Simulation Operations Automation platform that enables enterprise organizations to leverage the cloud for HPC. The Simr platform uses Kubernetes to orchestrate and deploy HPC clusters in multiple regions with minimal overhead. Simulation applications are packaged within OCI compliant containers to enable seamless workload deployment on the cloud.
To optimize simulation costs for an automotive customer running smaller 30-CPU LS-DYNA sled test models, Simr developed a solution that orchestrates multiple job containers on a single 120 CPU core HB120 V3 instance (AMD EPYC 7V73X). The technology aligns the number of jobs with the NUMA nodes on the instance. Each 30-CPU simulation, when assigned to a NUMA node, takes 50 hours to complete on a HB120 V3, compared to the 41 hours on legacy 36 CPU cores machines. However, since four jobs can run in parallel, the cost per job on the AMD instance is reduced by 75% compared to benchmarks, resulting in higher job throughput and significantly lower cloud-based simulation costs for the customer.

Michael Bambula, Technical Account Manager, Simr

Thursday: 12:00pm-12:30pm

Ansys Fluent®︎ and Ansys LS-DYNA®︎ on Latest Generation of Arm Processors

We will discuss the availability of Ansys Fluent and Ansys LS-DYNA on arm-based platforms. The performance of the applications on the latest generations of processors will be discussed.

Conrad Hillairet, Staff HPC Engineer, Arm

Thursday: 1:00pm-1:30pm

Pushing the engineering limits thanks to HPC and Cloud with Ansys and Microsoft Azure

Ansys Access on Microsoft Azure is a new offering available on the Azure Marketplace, enabling customers to run simulations in their own Azure subscription (BYOC) and using their existing licenses (BYOL). This new offer allows customers to use their existing Ansys applications and Azure services purchased directly from Microsoft to deliver cost savings, improved data management, and greater flexibility. 

Attend this live session to learn more about: 

What is Ansys Access on Microsoft Azure™ and why adopting a cloud hybrid approach could be a game changer for your business.

Latest advancements with HPS – HPC Platform Services

Our latest performances results and benchmarks for both CPUs and GPUs. 

JJ Jones, Global Cloud Business Development Manager, Ansys
John Baker, Cloud Business Development Manager (EMEA), Ansys

Additional Opportunities