Overview
At this premier conference, you will:
- Discover Key Insights: Learn from industry experts and simulation specialists about cutting-edge techniques and strategies in on-chip power integrity and reliability
- Explore Multi-Scale Multiphysics Challenges: Dive into complex topics, including multi-scale, multiphysics simulations essential for 3DICs and heterogeneous integration
- Accelerate Innovation: Gain valuable knowledge on how advanced simulation technologies like Sigma-DVD can streamline design processes and drive innovation
- Network with Experts: Connect with peers and Ansys experts, sharing experiences and exploring new opportunities for collaboration
IDEAS India is your opportunity to deepen your understanding of power-noise-reliability sign-off for Chip-Package systems, enhance your skills, and advance your engineering capabilities. Don’t miss this chance to be part of the conversation shaping the future of technology.
Key Discussion Topics
- SoC Power-Integrity and Reliability Sign-off
- Advanced Power Integrity Flows: Sigma-DVD, ROM, IR-ECO, etc
- 3DIC / Interposer – Power, Signal, Thermal Integrity
- Analog & Mixed-Signal Designs Power and Reliability
- RTL Power Analysis and Optimization
- Reliability Analysis: Electromigration, ESD, and Thermal
- Shift-left /In-design Analysis and Optimization
- Chip-Package-System Co-Simulation