Course Overview
This workflow allows you to have access to local metal fraction and thus local thermal conductivity, within a printed circuit board (PCB) in Ansys Fluent® fluid simulation software.
The thermal conductivity of a PCB varies considerably due to the layered construction and highly variable metal fraction at any location. Therefore, thermal analysis of a PCB requires knowledge of the orthotropic components of thermal conductivity (that is, X, Y, and Z components of thermal conductivity).
Ansys Fluent software provides the PCB model, to automate the workflow, enabling the necessary case settings to prepare for thermal analysis of the PCB zones. This includes, computing the orthotropic components of thermal conductivity as mentioned, and the power map distribution of a PCB.
Prerequisites
- Familiarity with Ansys Fluent software.
- Familiarity with Ansys Electronics Desktop (AEDT) software.
Teaching Method
Lectures and computer practical sessions to validate acquired knowledge. A major emphasis is placed on teaching by software demonstration and on the development of a solution to a design challenge from start to finish.