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Component Level Radiated Emissions using Ansys HFSS Software and Circuit with Mesh Fusion and Layout Component

Course Overview

This workshop explores the topic of product’s radiated emissions testing where the RF emissions from the product are measured at a certain distance and compared to certain compliance limits. This includes the combined emissions from the PCB and the associated cables. It demonstrates an end-to-end workflow for component level radiated emissions (RE) including PCB, cable, test setup as per CISPR 25 and biconical antenna. 

Prerequisites

  • Prior knowledge of Ansys HFSS design, boundary conditions, excitations, analysis setup and relevant parameters. 
  • Prior knowledge of Circuit Designer.
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Learning Outcome

Following completion of this course, you will be able to:

  • Design RE test setup using HFSS modelling capabilities and leveraging 3D components, mesh fusion and layout component for the PCB.
  • Understand the use of EMI Receiver probe to plot peak, quasi – peak and average emissions.

 Available Dates

Learning Options

Training materials for this course are available with an Ansys Learning Hub Subscription. If there is no active public schedule available, private training can be arranged. 

 

Agenda

This is a 1-day classroom course covering both lecture and workshop. 

Live Classroom Day 1 

  • Module: Layout Component, 3D Components, Mesh Fusion, EMI Receiver Probe 
  • Workshop: Component Level Radiated Emissions Modelling, Analysis & Post Processing