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Vertiv Uses Ansys Digital Engineering Technology to Drive R&D Transformation

Ansys intelligent engineering project will accelerate the development and delivery of customized data center cooling systems

Simulation, Software, and AI

Understanding the current trends in the automotive space

Source: Honeywell Aerospace Technologies

Honeywell smoothing developmental pathways with Ansys’ simulation software

Developing advanced propulsion systems based on sustainable aviation fuel and hydrogen fuel cells is both resource- and time-intensive.

Open-Source for AI Simulation and Modeling

Industry experts weigh the pros and cons of using open-source models for artificial intelligence

Ansys Stockholders Approve Transaction with Synopsys

Represents Key Milestone Toward Completion of Transaction with Synopsys

An example of the AnsysGPT dashboard that has a clean, easy-to-use interface

Ansys Releases AI-Powered Virtual Assistant AnsysGPT

The release of AnsysGPT includes a more extensive knowledge base and advanced infrastructure for scalability to enhance the real-time customer support experience

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Ansys and IonQ Are Bringing the Power of Quantum to the $10 Billion Dollar Computer-Aided Engineering Industry

IonQ and Ansys partner to enhance engineering simulation through advanced quantum computing

Computational fluid dynamics simulation results show the rotor temperature field with detailed mesh visualization, highlighting the streamlines of the surrounding fluid flow

WEG Uses Ansys Simulation to Design Revolutionary Industrial Motor

Ansys technology is instrumental in helping WEG develop an electric industrial motor that enables OEMs to push the limits of innovation through improved efficiency and productivity

semiconductor pc chip hardware platine detail prozessor board transistor

TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies

TSMC, Ansys, and Microsoft Accelerate Photonic Simulations

Ansys, TSMC, and Microsoft collaborate to speed-up simulation and analysis of silicon photonic components over 10X

EMag extraction of an interposer lane, including 48 signals in the presence of their respective VDD/VSS network and indicative simulation results, and S-Parameter analysis and transient (eye diagram) analysis of a signal line

Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis

Ansys' certified semiconductor solutions will enable Faraday to shorten design cycles of 2.5D/3D-ICs and ensure designs meet signal integrity and performance goals