Join our webinar to discover how High Bandwidth Memory (HBM) overcomes memory challenges in 3D systems, achieving data rates over 1 TB/s.
Time:
December 5, 2024
9:00 AM PST
Type of Event:
Virtual
To address the memory wall challenge in 3D heterogeneous integration systems, High Bandwidth Memory (HBM) in a 3D stacked configuration is the optimal solution. It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications. However, integrating HBM with other chiplets on a single interposer brings significant Multiphysics integrity challenges. High power and local hotspots generate excessive heat, causing mechanical stress, performance degradation, and reliability issues for HBM in a 3DHI environment. This webinar will explore these multiphysics challenges and introduce innovative modeling and simulation solutions.
IC/ Chip designers, IC/ Chip methodology engineers, 3DIC architects, System engineer
Lang Lin, Principal Product Manager
