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Ansys at DesignCon 2025

Booth 919

Visit us at DesignCon 2025 and discover how Ansys solutions combine high-precision simulation, advanced technology support, and industry-trusted reliability. They empower engineers to tackle challenges in 3D-IC packaging, system co-simulation, and thermal management while driving innovation in next-generation electronics and high-speed designs.

Date:
January 29-30th, 2025

Venue:
Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA 95054

Simulation from Silicon to Satellite

For 5G, autonomous vehicles, smart products, homes, cities, and factories to become reality, the enabling electronics technologies must deliver unprecedented levels of reliability. With innumerable sensors, microprocessors, and communication components, engineers face immense product reliability and performance challenges. Engineering simulation plays a critical role in helping high-tech companies deliver innovative and reliable products that achieve and exceed their target performance, energy-efficiency, cost, and speed-to-market goals.

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Highlights

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"Ask Eric" Panel and Happy Hour

Join us in our booth for an exclusive opportunity to dive into real-world engineering challenges with Dr. Eric Bogatin! Explore use cases like meandering differential signals, backdrilling, and manufacturing tolerances through a dynamic presentation featuring expert insights and practical examples. Stay for the interactive 'Ask Eric' Q&A session, where you can pose your toughest questions and gain personalized advice. Don’t miss this chance to learn how Ansys tools tackle complex problems and drive innovation in engineering!

Date: Wednesday, January 29th
Time: 2:30pm - 3:30pm

Agenda

DATETIMESUBJECTPRESENTER
01/2911:15AM - 11:45 AM
Power Delivery Network (PDN)
Kinger Cai - Senior Principal Engineer, ARM
01/291:30 PM - 2:00 PM
Bi-Directional Board Layout and Simulation
Joao Beck - Director of Enterprise Tech Marketing, Altium
01/293:00 PM - 4:00PM
“Ask Eric” Panel
Dr. Eric Bogatin - Professor, University of Colorado
01/301:30 PM - 2:00 PM
High Performance Computing
John Linford - Lead Technical Product Manager, CAE, NVIDIA
01/303:30 PM - 4:00 PM
'25 R1 Update
Juliano Mologni - Lead Product Manager, Electronics, Ansys

Speakers