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Ansys at DAC 2024

Join Us at the Design Automation Conference

Dates: June 23rd-27th
Booth #1308

 

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DAC Power Integrity Signoff

Leading in Power Integrity Signoff with Breakthrough Innovation

Ansys delivers the industry’s broadest range of foundry-certified golden signoff tools for semiconductor, electronic, and complete system design, including the latest 2nm nodes.

Stop by our booth to learn how our new SigmaDVD technology radically changes how leading customers analyze dynamic voltage drops.

See how the latest IR-ECO and IR-STA joint developments have integrated the industry’s best signoff engines, PrimeTime(tm) and RedHawk-SC(tm).

Industry-Proven 3D-IC Thermal and Multiphysics Analysis

When designing 2.5D/3D-IC systems, the distinction between chip, package, and system blurs and merges, requiring design engineers to overcome novel multiphysics challenges like Thermal Integrity, Mechanical Integrity, Electromagnetic Signal Integrity, and multi-die Power Integrity.

Talk to our experts about the Ansys RedHawk-SC Electrothermal(tm) platform for Thermal prototyping and signoff.

DAC Thermal Multiphysics Analysis
DAC Analog Signal Analysis

Unique Analog Mixed Signal Analysis and Optimization Capabilities

Ansys has significantly expanded its suite of analog analysis tools to include full-chip parasitic visualization and root-cause debugging with Diakopto ParagonX(tm). Transistor-level power integrity and ESD integrity have been supercharged by moving to the cloud-optimized SeaScape platform. RaptorX and HFSS are the industry’s most accurate solutions for high-speed, high-accuracy electromagnetic modeling—both on-chip and at the system level.

WE'RE SHOWING THE LATEST IN DESIGN TECHNOLOGY

Ansys Redhawk-SC performs IC electrothermal simulations

Address Power Integrity

EM/IR signoff analysis is exponentially more difficult with Dynamic Voltage Drop (DVD), but the new EM/IR analysis and debugging capabilities in the RedHawk-SC ™ family handle it easily.

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Ansys Signal Power & Integrity

Handle 3D-IC Electrothermal

Heat dissipation is a primary concern for all 2.5D/3D designs, and RedHawk-SC Electrothermal™ includes power integrity, fluid dynamics simulation for thermal cooling, mechanical simulation, and electromagnetic analysis.

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Ansys Electronics Desktop Student Is Added to Free Software Downloads

Analyze and Measure System Reliability & Hardware Security

From power integrity, signal integrity, electromagnetic and thermal simulation, Ansys solutions analyze and measure the vulnerability of silicon circuits to hardware side-channel attacks.

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Modeling Coupling Between Cables and Platforms for Electromagnetic Compatibility with Ansys EMA3D Cable

Manage Electromagnetic Coupling & Interference:

Wi-Fi, 5/6G, and high-speed digital backplanes require accurate electromagnetic modeling, and RaptorX™ delivers the speed and capacity to analyze today's largest silicon designs in a single run.

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logic-3.png

Enable RTL Power Analysis & Optimization

Hardware emulators execute real applications, generating enormous quantities of vector data. PowerArtist™ analyzes these vast data streams to extract critical vector subsets that capture peak power and reduce power consumption.

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Script, Process and Optimize Photonics

The industry's most complete optical design and analysis flow.

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DAC Analog Card

Advanced Parasitic Visualization, Debug, and Root-Cause Analysis

High-capacity parasitic debug and visualization for top-level AMS designs. A rich suite of analysis tools quickly identify the root cause of performance issues using only the layout DSPF as input.

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6 Workshops – At Ansys Booth #1308

June 24, 2024 10:00 AM -12:00 PM
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Dynamic voltage drop (DVD) has become a very challenging issue for designers at advanced process nodes and ultra-low supply voltages.  Ansys has introduced SigmaDVD™ -  a once-in-a-decade breakthrough technology - to radically improve DVD coverage and to shift-left with early prediction and avoidance.

June 24, 2024 2:00 - 4:00 PM
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As the number of instances in IC designs continues to increase, it has become imperative to enable hierarchical design for full system analysis.  Ansys addresses this with a range of multiphysics reduced order models (ROMs) that dramatically reduce the required compute resources while maintaining full analysis accuracy.

June 25, 2024 10:00 AM - 12:00 PM
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Muti-die designs have been adopted by many leading companies for the many benefits they offer for integration density, cost, performance, and flexibility. However, they also present new challenges with complex multiphysics interactions in the areas of  thermal integrity, signal integrity, and mechanical reliability that require new design methodologies.

June 25, 2024 2:00 - 4:00 PM
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AI/ML has emerged as a powerful technique for achieving better system performance and super-charging designer productivity. Ansys has enabled AI solutions at multiple levels - both within the tools for more efficient multiphysics algorithms, and also outside the tools for optimized system configuration. 

June 26, 2024 10:00 AM - 12:45 PM
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Analog designs are increasingly dominated by parasitic effects. Ansys offers a range of analog analysis solutions for in-design early parasitic optimization, high-speed signal modeling, and final power integrity/ESD signoff . We will also present Ansys solutions for hardware security aimed at reducing side-channel vulnerabilities.

June 26, 2024 2:00 - 4:00 PM
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Early power analysis is the key to reducing power, especially with today’s advanced designs relying on hardware emulators for activity. Ansys RTL power analysis has made significant advances in timing and physical awareness, automatic RTL power reduction, and comprehensive glitch power analysis. 

See What Ansys Can Do For You

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