Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
Ansys is committed to setting today's students up for success, by providing free simulation engineering software to students.
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Interested in architecture, engineering, and construction (AEC), printed circuit board (PCB) design, sustainability, and digital twins? Come see Ansys at booth 148 at AU 2024: The Design and Make Conference, a global conference for the design and make community of architecture, engineering, construction, product design, manufacturing, media, and entertainment creatives. Visit us to see how Ansys simulation solutions for AEC, electronics product design, and sustainability can help you make better, faster engineering decisions. Make sure to tune in to the following sessions to learn how the partnership between Ansys and technology partner Autodesk is founded on breaking down engineering silos in the product design process and democratizing simulation technology to designers and engineers.
Juliano Mologni, lead electronics product manager at Ansys, and Edwin Robledo, senior technical marketing manager at Autodesk, will present “Expanding Capabilities With Partnerships: Autodesk Fusion and Ansys Synergy,” on Wednesday, Oct. 16, at 3 p.m. Pacific Time. This session focuses on the groundbreaking partnership between Autodesk and Ansys and how the Autodesk Fusion Electronics Signal Integrity Extension is revolutionizing PCB simulation processes. You can learn more about how Ansys-powered Autodesk Fusion Signal Integrity improves PCB design.
Energy efficiency, safety, and technology integration are fundamental to AEC design and analysis. Ansys’ world-class computational fluid dynamics (CFD), structural, and electromagnetic solutions enable engineers to access high-fidelity physics to explore multiple scenarios and optimize designs early. On Thursday, Oct. 17, at 10:30 a.m. Pacific Time, Reni Raju, strategic partnerships director at Ansys, and Mologni will look at how these integrated solutions improve domain-specific applications — including HVAC system optimization, atmospheric modeling, indoor air-quality assessments, and 5G/6G channel predictions. Their presentation, "Advancements for Simulations in Built Environments" will showcase the benefits of the Autodesk and Ansys collaboration for accuracy and interoperability in AEC and health and safety.
In addition, Sean Ahern, principal R&D engineer at Ansys and a member of the Alliance for OpenUSD, will join a panel of technical visionaries as they explore the role of Universal Scene Description in fostering open data exchange across industries in the session “OpenUSD: The Path to Interoperability in VFX and Beyond,” on Thursday, Oct. 17, at noon Pacific Time. OpenUSD is an extensible framework and universal interchange between 3D and simulation data tools and ecosystems.
Ansys is using these cutting-edge technologies, in collaboration with NVIDIA, to deliver new capabilities that will enhance the accuracy, efficiency, and realism of virtual prototypes and provide immense value to customers across industries by narrowing the gap between reality and simulation.
Visit our booth to see how we are bringing real-time photorealistic rendering and accurate electromagnetic/radio frequency (EM/RF) simulation to digital twins in collaboration with NVIDIA. Ansys Perceive EM RF channel and radar signature simulation software is specifically tailored for RF and EM domains, and through its seamless API integration with NVIDIA Omniverse and OpenUSD, engineers can simultaneously evaluate multiple domains — including radar, signal bandwidth, camera systems, and lidar — all in a unified simulation environment. This ability to collect immediate feedback on performance and functionality will enable engineers to streamline their project workflow, optimize layouts for telecom systems and digital factories, and accelerate the design and deployment of radar sensors.
Interested in artificial intelligence (AI)? Come to our booth to learn more about the Ansys SimAI platform, a physics-agnostic, cloud-enabled generative AI platform that combines the predictive accuracy of Ansys simulation with the speed of generative AI. It is an intuitive, easy-to-use platform designed for experts and nonexperts alike, which uses the shape of a design itself as the input rather than geometric parameters to facilitate a broader design exploration space. For computation-heavy projects, the application can boost prediction of model performance across all design phases by 10 to 100 times by enabling users to test design alternatives without the computational constraints and complexities of traditional solvers. Join us to learn how combining AI with simulation can enable next-level innovation in engineering.
Autodesk and Ansys are partnering to bring the power of simulation to product designers in AEC, PCB design, sustainability, and the digital twin space. Register for AU 2024: The Design and Make Conference, and then visit us at booth 148 to see what we can do to help you and get your input on the next generation of tools for AEC and manufacturing.
The Ansys Advantage blog, featuring contributions from Ansys and other technology experts, keeps you updated on how Ansys simulation is powering innovation that drives human advancement.