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Craig Hillman


 

Ansys Blog Authors

Craig Hillman

Senior Vice President and General Manager, GaitBetter

Craig is an investor who helps companies with corporate strategy, product development, and sales and marketing execution. He joined Ansys in 2020 as the Director of Product Development, where he lead the integration of DfR Solutions/Sherlock within Ansys after it was acquired. He then became Director of Product Management for New and Emerging Technologies, where he was responsible for product roadmapping, go-to-market strategies, and marketing activities for additive manufacturing and battery simulation products. Craig is currently Senior Vice President and General Manager of GaitBetter.

Education:

  • Bachelor of Science degree in Material Science from Carnegie Mellon University
  • Doctor of Philosophy degree in Material Science from the University of California, Santa Barbara

Time at Ansys: May 2019 - October 2020

Articles by This Author

Futuristic car

How the SAE J3168 Standard Will Improve Automotive Electronic Hardware

SAE J3168 describes a baseline process to assess board-level reliability and durability of electronics with respect to five major potential failure mechanisms.

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Physics of failure (PoF) based on design for reliability (DfR) improves concept, feasibility, alpha, beta, launch and production reliability.

What Is Physics of Failure?

Learn how Physics of Failure and Design for Reliability can improve product performance throughout the development cycle.

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ANSYS Sherlock mechanical cycling simulation of a board

Mitigate BGA and QFN Failures Using Redesigns, Underfills, Edge Bonds or Corner Staking

Learn how to mitigate BGA and QFN solder joint failures using RPA-based redesigns, underfills, edge bonds or corner staking.

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An Ansys Sherlock model of PCB layout geometry

How to Overcome PCB Modeling Challenges

PCBs and components that drive them face increasing power densities and complexity. Learn how Ansys Sherlock ensures product reliability and performance.

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Sherlock thermal derating

Thermal Degradation of Electronics: How Hot is Too Hot?

Simulations help engineers determine the maximum operating temperature of electronics to avoid thermal degradation.

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thermal management systems cfd fea In order to fully capture the effects of the part temperature rises, the Ansys Icepak CFD results (left) are included as input for the structural FEA analysis — through the project schematic (right)

Thermal Management Systems: How Hot Is Too Hot?

New workflow makes it easier for engineers to assess thermal management systems and understand if PCB components get too hot during operations.

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Diagram of a ball grid array (BGA)

Digital Image Correlation: A Key Technique for Materials Characterization

Learn how engineers can use cameras to assess the reliability of ball grid array (BGA) devices using digital image correlation (DIC).

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Woman working at a futuristic computer

How to Ensure Electronic Product Reliability When You Don’t Have Time to Test

Design for Reliability is a process that ensures a product will perform a specified function, within a defined environment, over an expected lifetime. Learn more.

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Safety features in the modern automobile

Overcome Automotive Electronics Reliability Engineering Challenges

Learn why automotive electronics require consideration beyond conventional approaches to ensure successful reliability engineering.

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