Webinar
Enabling FinFET Thermal Reliability Signoff for IPs
Ansys Totem can solve the challenges faced by engineers trying to ensure thermal and electromigration (EM) reliability in advanced IPs. View this webinar to see a demonstration of self-heat analysis on an IP test case using Ansys Totem’s rich GUI interface. The demonstration will cover flow setup, debugging and result exploration for reliability signoff.
