ANSYS at International Microwave Symposium 2013

ANSYS is thrilled to once again be attending the IEEE MTT International Microwave Symposium (IMS). IMS is a premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as a full set of social events. The symposium also hosts a huge commercial exhibition.

We hope to see you at IMS 2013, at the ANSYS Booth #838, and at one of the sessions ANSYS is presenting at:

Technical Session – WE1D, Wedensday June 5 at 8am Room 605/610

  • A Fast and Efficient Domain Decomposition Approach for Finite Antenna Arrays

This paper describes a domain decomposition technique for finite element modeling of repetitive structures such as antenna arrays. The scheme leverages the repeating nature of an array to minimize the setup time for the domain matrices and the amount of computational resources required for a solution. The technique can be applied to arbitrary outlines or “array masks” of geometries including sparse arrays. Furthermore the ability to leverage a “composite excitation vector” to analyze specific scanning conditions as one effective excitation provides an extremely fast answer for very large and complex finite antenna arrays. Comparison results between this technique and an explicit FEM solution will be presented along with a solution performance for a 1024 element dual slant polarized Vivaldi array.

Micro Apps

  • ANSYS HFSS: Hybrid IE Solvers for Efficient Simulation of Complex Systems
    Tuesday, June 4 at 10:50am presented by David Edgar

The 3D Electromagnetic field solver, HFSS, is widely used in the RF/Microwave industry for simulation of 3D microwave structures, including antenna and scattering problems. Recent trend in antenna design is towards system/platform simulation enabling installed performance to be evaluated. The challenge is to solve these electrically large models whilst maintaining accuracy and speed. HFSS is based on the Finite Element Method (FEM), which is very well suited to model arbitrary complex structures. Recently, the Integral Equation (IE) technique was introduced into HFSS as a new 3D solver type and this solver has been combined with the existing FEM solvers in a hybrid technique known as the Finite Element Boundary Integral (FE-BI) Method. In addition, this technique has recently been extended to enable IE regions to be defined within the solve domain for metals and dielectric objects, where the IE solver is used directly on these objects, which helps to reduce overall mesh and solve time. This new state of the art technique enables engineers to tackle and new range of problems accurately and efficiently.

  • HFSS with HPC for Large Finite Antenna Array Design
    Wednesday, June 5 at 2:50pm presented by David Edgar

The 3D Electromagnetic field solver, HFSS, is widely used in the RF/Microwave industry for simulation of a diverse range of microwave antenna structures, including smaller discrete structures such as patches, dipoles, horns etc as well much larger scale antenna arrays.

The Domain Decomposition Method (DDM) is a technique which enables a large 3D model’s mesh and solution to be solved utilizing multiple cores/machines and shared memory resources (HPC). Whilst this technology can be applied to large arbitrary structures such as a reflectors or antenna in vehicle etc, large antenna arrays have unique properties related to their size and repetitive nature which are well suited to this technique. Operating on the antenna unit cell removes the need to handle repetitive detailed geometry, reduces model setup overhead and dramatically reduces time associated with meshing the structure and hence lowers overall solve time.

The finite array technology recently implemented within HFSS brings forward a robust, powerful capability for antenna array simulation, automating setup and post processing as well as offering dynamic control of elements in the array for investigating active array performance, whilst delivering an order of magnitude reduction in simulation time and resources required for the most challenging array models.

  • Bi-directional Coupled Full-Wave EM to Thermal Stress Simulation
    Thursday, June 6 at 9:50am presented by Arien Sligar

The design of high performance RF/microwave systems and components often requires consideration of operating in a real-world multi-physics environment. Understanding the interaction between multiple coupled physics is essential for an accurate system analysis. With R14.5, ANSYS offers a comprehensive solution capable of performing bi-directional coupled analysis between EM, thermal, structural mechanics and fluid flow. This presentation will demonstrate the new capability through several examples, where it is important to consider not only individual physics, but also the coupled interaction. A typical design flow is demonstrated, using HFSS to calculate RF losses, ANSYS Mechanical for thermal and structural analysis, and ANSYS FLUENT or ANSYS Icepack to analyze fluid flow. Data exchange between physics is automated using the intuitive design flow of ANSYS Workbench. Providing both thermal and mesh deformation feedback into HFSS where the electrical performance can be re-analyzed to predict realworld performance.