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Ansys Innovation Conference

Accelerating Product Design and Innovation with Digitalization and AI-led Simulation

Join us for the Ansys Innovation Conference - a place to catch up on the latest advances in product design and innovations across industries including defense, aerospace, transportation, high-tech, semiconductor and electronics. This conference will explore future trends with keynotes from industry leaders and offer technical insights by experts covering wide range of topics from multi-physics simulation to digital engineering.

Venue:
Grand Copthorne Waterfront Hotel
392 Havelock Road,
Singapore 169663

Time:
October 3, 2024
8:30 am to 4:00 pm Singapore Time (SGT)

We regret to inform you that we have reached our maximum capacity and, as a result, registrations are now closed. We appreciate your interest and understanding.

About this Event

Industries are undergoing a significant transformation, driven by technology trends focusing on sustainability and digitalization. From defense, aerospace, and mobility advancements to intelligent connectivity, cutting-edge electronics, technology is revolutionizing every facet of our lives. However, numerous challenges are involved in this transformation journey due to increased product complexity, variants, disciplines, and costs associated with test-fail-repeat cycles.

In such a complex design environment, engineers must visualize every aspect of the product, understand the trade-offs they are making, and arrive at design decisions that combine innovation with reliability, cost control, and reduced time to market. Engineers increasingly employ simulation, virtual prototyping, and digitalization across product development to accelerate design and innovation. For example, engineers can make 10x to 1000x faster and more accurate predictions through AI-augmented simulation.

Join us for the Ansys Innovation Conference, where engineering leaders and experts from different industries will discuss emerging technology trends, challenges, solution practices, and the role of simulation. Participants will learn about the overall landscape of product development, from complex multi-physics to digital engineering.

Industry Tracks

Defense, Mobility, and Transportation
The defense and mobility industry is undergoing a disruptive transition with the convergence of multiple technologies and megatrends. Companies need to accelerate design exponentially to deliver efficient, safe, and connected experiences. Engineers are increasingly adopting simulation and digitalization to accelerate product development. This track will focus on various aspects of
defense and mobility product development, from component to system validation.

High-tech, Semiconductors, and Electronics
In the rapidly evolving world of smart, connected, and autonomous technologies, semiconductors and electronics are ubiquitous across various low to high-frequency applications. Engineers face immense product reliability and performance challenges with numerous sensors, microprocessors, and communication components. Simulation is critical in helping high-tech companies deliver innovative and reliable products. This track will cover various topics, including electromagnetics, electromechanical, optics, connectivity, and more.

Product Tracks

Fluids & Mechanical 

By gaining insights into the forces that affect fluid flow using CFD analysis or solving complex structural engineering challenges, simulation plays a very crucial role to help engineers make critical design decisions to improve product performance. This track will cover what’s new in Ansys Fluids & Mechanical products.

Electronics & Optics

Simulation enables the successful modeling, analysis and design of many of high- and low-frequency electronics applications, optics and photonics components, modules, circuits, and systems. This track will cover what’s new in Ansys Electronics & Optics products.

What Attendees Will Learn

  • Next-gen product innovation trends
  • Multiphysics – Mechanical, CFD, Thermal, Electromagnetics
  •  Electronics reliability, EMI/EMC
  •  Chip/Package/Board
  •  Optics and Photonics
  •  Industry 4.0 / IoT
  •  Advanced simulation practices
    •  AI/ML, Cloud, GPU computing
    •  Digital twin, MBSE, Automation

Who Should Attend

  • R&D engineers, managers, department heads
  • Design engineers, managers, department heads
  • Product development engineers, managers, department heads
  • Quality engineers, managers, department heads
  • Research, academia
  • Startups
  • Industries: aerospace and defense, high-tech, semiconductor
    and electronics, automotive, and transportation

Agenda

TimeSession
08:30 -   09:30Registration + Tea/Coffee
09:30 - 09:40Welcome Note and Context Setting
Sukhwan Moon, Area Vice President, Korea, Taiwan and ASEAN & ANZ, Ansys
09:40 - 10:00Ansys Corporate Keynote
Scott Davidson, VP Marketing, Ansys
10:00 -   10:15Industry Keynote
Hoo We Tak, DX Project Director, Hyundai Motor Group Innovation Center Singapore (HMGICS)
10:15- 10:30Advancing Product Design and Innovation with Simulation-Driven Digital Engineering
Padmesh Mandloi, Regional VP - Customer Excellence APAC, Ansys
10:30- 10:50Tea/Coffee + Networking + Technology Showcase
10:50- 11:05Industry Keynote: Driving Next-Gen Product Innovation - From Ideation to Design, Engineering, and Application
Rayner Ng Chun Piaw, Director, Innovation Factory, A*STAR SIMTech
11:05 - 11:20Industry Keynote
11:20 - 11:40Engineering What's Ahead in Space & Defense
Shuzo Otani, Area Vice President Sales, Aerospace and Defense, APAC, Ansys
11:40 - 12:00Virtualization of Chip-Package Co-design for Shift Left in Product Development
Vamsi Krishna, Director- Customer Excellence, Ansys
12:00 - 12:15Industry Keynote: Simulation & Material characterization for Heterogeneous Integration of Semiconductor Packaging
Dr. Lee Teck Kheng, Director of Technology Development Centre ITE College Central
12:15 -13:15Lunch Break
 Product Track 1
Fluids & Mechanical
Product Track 2:
Electronics & Optics
13:15 - 13:30What's New in Ansys Fluids
Bakytzhan Akhmetov, Senior Application Engineer, Ansys
What's New in Ansys Electronics
Desmond Tan, Principal Application Engineer, Ansys
13:30 - 13:45What's New in Ansys Mechnical
Dr. Yong Kin Yew, Technical Manager, CAD-IT Consultants (Asia) Pte Ltd
What's New in Ansys Optics
Eric Cheung, Application Engineering- Optics and Photonics, CADFEM SEA Pte Ltd
 Industry Track 1
Defense, Mobility and Transportation

Industry Track 2:
High-tech, Semiconductor and Electronics
13:45 - 14:05Electrification and Autonomy in Mobility
Shitalkumar Joshi, Senior Director, Ansys India-ASEAN
Multi-Chiplet Heterogeneous Integration for AI System in Package
Dr. Surya BHATTACHARYA, Director, System in Package (SiP), A*Star Institute of Microelectronics (IME)
14:05 -14:25University Microsatellite Structural Design and Simulation with Ansys Software Solutions
Lee Chon Kiat, Mechanical Lead, NTU-SaRC
Industry Presentation
PV Ramana Founder-CTO, LightSpeed Photonics
14:25 -14:45Digital Mission Engineering for Multi-Domain Defense Systems
Karynna Tuan, Manager Application Engineering, Ansys
Designing Next Generation RF Devices with Ansys Multiphysics Flow
Vamsi Krishna, Director- Customer Excellence, Ansys
14:45 -15:00Tea/Coffee + Networking + Technology Showcase
15:00-15:20Accelerating Autonomous Vehicle Testing with Simulation
Roshan Vijay, Head of Simulation-based Testing, Validation and Research, CETRAN
Thermomechanical Reliability of Electronics from 2.5D/3D-ICs to Systems
Bharat Panjawani, Lead Application Engineer, Ansys
15:20 - 15:35Q&AQ&A
15:35- 15:40Concluding RemarksConcluding Remarks
15:40 : 16:00 Networking + Technology Showcase