Webinar
How Ansys Sherlock’s Pre-Processing Engine Creates High-Fidelity Models for Ansys Mechanical & Icepak
Printed Circuit Boards (PCBs) are complex structures from both geometric and material viewpoints and are often simulated (and tested) under a variety demanding environmental conditions (shock, vibration, drop, etc.) to ensure they meet the necessary requirements. Specifically, they are geometrically complex in that they contain both surface-mounted and internal components (e.g., traces, vias) that need to be captured to ensure true-to-life behavior is being simulated. In such cases, Ansys Sherlock’s powerful Pre-Processing capabilities allow users to rapidly generate high-fidelity models intended for use with tools such as Ansys Mechanical and Ansys Icepak.
In this webinar, we will discuss a range of pre-processing/modeling techniques that are available in Ansys Sherlock for addressing such challenges, as well as the relative merits of these approaches, to help you ensure you are choosing the right level of fidelity for your studies.
Specifically, we will address:
- PCB modeling strategies such as Homogenization, Trace Mapping, Trace Modeling, and Reinforcement Elements
- Component and Solder/Lead Modeling
- Underfill, Corner Staking, and Coatings
- Suitable modeling approaches when exporting models from Ansys Sherlock to Ansys Icepak.
- We will also discuss downstream modeling strategies, such as submodeling/zoom-in modeling, that provide additional accuracy in Ansys Mechanical and Ansys Icepak.
