Flexible Simulation Methods

Multiphysics technology from ANSYS delivers two proven solution techniques to solve multiphysics problems: direct coupled-field elements and the ANSYS multi-field solver. These approaches provide flexible simulation methods to solve a broad range of both direct and sequentially coupled multiphysics problems, such as induction heating, electrostatic actuation, Joule heating and fluid–structure interaction (FSI).

Coupled thermal–electric solution of buss bar of short-circuit test transformer with current up to 150 kA. Electric conduction coupled with heat transfer analysis, performed in ANSYS Workbench

Model courtesy WEG Electrical Equipment.

Direct Coupled-Field Elements 

Direct coupled-field elements allow users to solve a coupled-physics problem by employing a single finite element model with the appropriate coupled-physics options set within the element itself. A direct coupled-field solution simplifies the modeling of multiphysics problems by allowing users to create, solve and post-process a single analysis model for a wide variety of coupled-field problems. Capabilities include thermoelasticity, piezoelectricity, piezoresistivity, piezocaloric effect, Coriolis effect, electroelasticity, thermoelectricity and thermal–electric–structural coupling.

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Coupled thermoelectric simulation of IC metallization structure performed using direct coupled-field elements in ANSYS Workbench: current density (top) and temperature (bottom)

ANSYS Multi-Field Solver 

The ANSYS multi-field solver enables users to solve multiphysics problems by employing automated implicit sequential coupling, which couples multiple single-physics models in one unified simulation. The ANSYS multi-field solver employs robust, iterative coupling in which each physics discipline is solved sequentially and convergence is obtained between the individual disciplines at each time point during the solution. The multi-field coupling is based on customized interprocess communication technology, and no third-party coupling software is required. Coupling capabilities include thermal–structural, thermal–electric, thermal–electric–structural, electromagnetic–structural, electromagnetic–thermal, electrostatic–structural, thermal–electric–fluid, fluid–thermal and fluid–structure interaction.

Fluid–structure interaction of  three-lobe valve; simulation solved using ANSYS Multi-field solver. The model includes non-Newtonian blood flow and anisotropic hyperelasticity to model biological tissue.