ANSYS Electronics HPC
High-performance computing (HPC) adds tremendous value to engineering simulation, providing high fidelity, accuracy and speed that offer insight into product performance. ANSYS Electronics HPC specifically enables parallel processing for solution of the toughest, higher-fidelity models — including more geometric detail, larger systems and more complex physics. Using ANSYS Electronics HPC to understand detailed product behavior gives you confidence in the design and helps to ensure that your product will succeed in the marketplace.
HPC capabilities for electronics applications are available through HPC packs and solutions as well as via specific technologies and features embedded in the software.
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ANSYS Electronics HPC Packs are a flexible way to license parallel processing capability. For single users who want the ability to run simulations on a workstation, a single Electronics HPC Pack provides great value with increased throughput of up to eight times. For users with access to larger HPC resources, multiple HPC packs can be combined to enable parallel processing on hundreds or even thousands of processing cores. ANSYS HPC packs offer virtually unlimited parallel processing for the biggest jobs, combined with the ability to run multiple jobs using every day parallel capacity.
ANSYS Electronics HPC Workgroup licenses enable the total number of processing cores that a team has available for ANSYS applications. Each simulation can use any number of parallel processing instances enabled under the HPC Workgroup license. If there are multiple users running on workstations or users accessing a larger HPC resource for their most challenging simulations, HPC Workgroup licenses can be flexibly deployed where needed.
ANSYS Electronics HPC Enterprise licenses are designed to enable a distributed team of users to use the total number of processing cores that a company has available wherever that capacity is located. Each simulation can use any number of parallel processing instances enabled under the Electronics HPC Enterprise license. Wherever there are users, wherever there are HPC resources, the HPC Enterprise solution enables use of parallel processing.
ANSYS Electronics HPC provides the parallel processing capability required to accelerate time to solution and solve the highest fidelity problems. The full portfolio of ANSYS electromagnetic solvers — including ANSYS HFSS, ANSYS Q3D Extractor, ANSYS SIwave, ANSYS Maxwell and ANSYS Designer — all use the same ANSYS Electronics HPC licenses to execute in parallel. Buy once, deploy once, and use parallel processing when and where it is needed.
ANSYS Electronics HPC takes advantage of multiple cores on a single computer to reduce solution time. Multithreading technology speeds up the initial mesh generation, direct and iterative matrix solves, and field recovery. Users will see up to 20 PERCENT better performance than the previous generation multi-processing license.
The majority of electromagnetic simulations require results such as field, far field and s-parameter data over a range of frequencies. The traditional method, consisting of running each frequency in sequence, is can be time consuming. Spectral decomposition method technology in ANSYS Electronics HPC distributes the multiple frequency solution over networked compute cores to accelerate frequency sweeps. You can use this method in tandem with multithreading, as multithreading speeds up extraction of each individual frequency point while spectral decomposition performs many frequency points in parallel. The spectral decomposition method is scalable to large numbers of cores, offering significant computational speed.
The domain decomposition method (DDM), available only for ANSYS HFSS, distributes a simulation across multiple, potentially networked cores to solve larger and more complex problems. This method is primarily designed to tackle larger problem size with the distributed nature of the solution. It also provides results in shorter solution times.
DDM generates a continuous finite element mesh over the entire structure, then subdivides that mesh and uses a distributed-memory parallel technique to distribute the solution for each mesh subdomain to a network of processors. This substantially increases simulation capacity. Domain decomposition is highly scalable to large numbers of processors and takes advantage of multithreading within the mesh subdomains to reduce solution times for individual subdomains.
Periodic Domain Decomposition
The periodic domain decomposition method available for HFSS uses a distributed-memory parallel technique for finite periodic geometries such as antenna arrays. This method distributes unit cell mesh subdomains to a network of processors and RAM while an industry-standard MPI maintains communications between domains. Simulation capacity and speed are substantially increased by re-using the adaptive mesh from a single unit cell for a large finite periodic structure and processing the duplicated unit cells across a large number of processors. This method combines with multithreading to provide faster solves for each of the individual subdomains. The automated generation of domains makes this method easy to learn and implement.
Hybrid Domain Decomposition Method
The hybrid domain decomposition method uses the domain decomposition method on models consisting of finite element (FEM) and IE domains. The HFSS integral equation (IE) solver add-on makes it possible to create HFSS models that use a hybrid FEM–IE methodology to solve large EM problems. This methodology provides the best of two powerful techniques: the finite element method’s ability to handle complex geometries plus the method of moments (MoM) direct calculation of the free-space Green's function, which leads to accurate radiating and scattering solutions. The hybrid domain decomposition method significantly increases simulation capacity by using the distributed memory parallel technique to distribute the matrix solution to a network of processors and RAM.
The distributed matrix solver is a distributed memory parallel technique for the HFSS integral equation solver (IE) solver. HFSS-IE uses the method of moments (MoM) technique to solve for sources and currents on the surfaces of conducting and dielectric objects. The distributed matrix solver significantly increases HFSS-IE simulation capacity by using the distributed-memory parallel technique to distribute the matrix solution to a network of processors and RAM. This method combines with multithreading to provide faster solves for each of the individual subdomains.
With ANSYS Electronics HPC, you won't need an IT expert or parallel processing guru. With a few simple menu picks, ANSYS software can be set up and launched to execute in parallel on a multi-core workstation or remote compute cluster. Everything needed to install, including message passing interface (MPI) tools, comes bundled with software from ANSYS so you can get right to work.
ANSYS technology is enabled to support load managers and job schedulers, including Platform LSF, PBS Professional and Microsoft Windows HPC Server. Using GUI panels and/or customizable scripts, you can integrate ANSYS tools into your workload management environment with ease.
ANSYS Electronics HPC provides parallel processing on a range of computing platforms. ANSYS HPC can be used on a multi-core workstation, substantially increasing throughput on single jobs. For workgroups or multiple job execution, clusters running Linux or Microsoft Windows will provide scalable capacity and performance. ANSYS MPI-based parallel processing supports Gigabit Ethernet (GigE) or Infiniband interconnects from a variety of vendors, and the MPI tools required come fully bundled with the software. Software from ANSYS is Intel Cluster Ready (ICR) certified, ensuring smooth deployment and execution on ICR vendor solutions.
ANSYS makes a sustained investment in HPC software innovation, which culminates superior performance when using ANSYS Electronics HPC solutions. ANSYS is well recognized in the HPC industry, and the company's HPC partners invest in ANSYS to ensure best-in-class performance on their latest technologies. Most important is that HPC is an ongoing focus area for ANSYS, so customers can gain the most value from the HPC technologies of the future.
ANSYS is working now to enable simulations on 10,000+ cores, with new innovative solver technologies, enhanced usability and scalability across the full simulation process. When you choose ANSYS, you can be assured that your simulation provider has a roadmap into the HPC future.
ANSYS works with HPC leaders, including partners like Intel, AMD, Microsoft, HP, IBM, Dell and other leading OEMs, resellers, technology vendors and system integrators. Our technical collaboration with these partners ensures that ANSYS clients get the coordinated expert support needed at all phases of HPC deployment. From system specification to installation, tuning, troubleshooting and maintenance, ANSYS partners can help you to minimize risk and increase the productivity of HPC systems.
Visit the partner solutions showcase and learn which partners are working closely with ANSYS to deliver HPC solutions tuned to customers' needs.