ANSYS SIwave links with the ANSYS software portfolio for multiphysics simulation of electronic components. One option is the ability to export a power distribution map from SIwave into ANSYS Icepak. This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with the dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. Thermal stress can then be evaluated with ANSYS Mechanical. This multiphysics approach allows engineers or groups of engineers to perform coupled EM-thermal-stress analysis for a complete understanding of the design.