Chip-Package-System PlatformANSYS SIwave is the platform for the industry’s first end-to-end chip-package-system design flow. SIwave integrates multiple electromagnetic field solvers, IC design and thermal analysis software tools in a comprehensive new approach to enable CPS design convergence. By using advanced modeling and proven simulator technologies, this new approach for CPS convergence changes outdated compartmentalized chip, package and system design methodologies. This enables an intelligent, integrated, chip-aware system design that addresses power and signal integrity, EMI/EMC, and thermal and stress challenges.
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