Signal- and Power-Integrity Analysis

The ability to generate highly accurate reduced-order models for use in a circuit simulation makes Q3D Extractor the ideal software to perform signal- and power-integrity analysis to study crosstalk, ground bounce, interconnect delays and ringing and to understand the performance of high-speed electronic designs such as multi-layer printed circuit boards, advanced electronic packages and 3-D on-chip passive components. In addition, Q3D Extractor is essential for extracting accurate electrical parasitics of critical interconnect components in the package (bondwires) or on the board (critical nets) and for the connection path between the chip, package, and board (i.e., connectors, cables, sockets, and transmission lines). By leveraging Q3D Extractor dynamic links to Ansoft Designer, engineers benefit from an advanced design flow so you can easily investigate the effects that electrical parasitics have on circuit performance.