Signal- and Power-Integrity Analysis
The ability to generate highly accurate reduced-order models for use in a circuit simulation makes ANSYS Q3D Extractor the ideal software to perform signal- and power-integrity analyses. Engineers can study crosstalk, ground bounce, interconnect delays and ringing; this helps them to understand the performance of high-speed electronic designs, such as multilayer printed circuit boards, advanced electronic packages and 3-D on-chip passive components. In addition, Q3D Extractor is essential for extracting accurate electrical parasitics of critical interconnect components in the package (bondwires) or on the board (critical nets) and for the connection path between the chip, package and board (i.e., connectors, cables, sockets and transmission lines). By leveraging Q3D Extractor's dynamic links to ANSYS Designer, engineers benefit from an advanced design flow to easily investigate the effects that electrical parasitics have on circuit performance.