Thermal Management

More and more, consumer electronics devices contain powerful electronic components, crammed into tighter-than-ever-before spaces, that must not be allowed to overheat. ANSYS Icepak software enables system-level CFD simulation, including radiation, conduction, and natural and forced convection air cooling for a variety of complex geometries. Joule heating loads in package and PCB substrates can be performed in ANSYS SI/PI products and incorporated into the thermal design analysis.

Thermal management of cell phone using ANSYS Icepak