Mechanical & Thermomechanical

Engineers use software from ANSYS to examine thermomechanical stresses in computer packages and boards. The technology also can be applied to address thermomechanical fatigue that develops during a device‚Äôs continual on-and-off cycle. ANSYS tools can simulate disk rotary dynamics, including the impact of thermally induced deformation. 

Explicit solvers in ANSYS Mechanical software assist in studying the mechanical stresses that develop as a result of vibration or dropping. 

Stress analysis of PCB using ANSYS Mechanical

Model courtesy CADFEM GmbH.